Patents by Inventor Kenyu TOJIMA

Kenyu TOJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three dimensional passive multi-component structures
    Patent number: 8942002
    Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: January 27, 2015
    Inventors: Shawn X. Arnold, Douglas P. Kidd, Sean A. Mayo, Scott P. Mullins, Dennis R. Pyper, Jeffrey M. Thoma, Kenyu Tojima
  • Three dimensional passive multi-component structures
    Patent number: 8767408
    Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: July 1, 2014
    Assignee: Apple Inc.
    Inventors: Shawn X. Arnold, Douglas P. Kidd, Sean A. Mayo, Scott P. Mullins, Dennis R. Pyper, Jeffrey M. Thoma, Kenyu Tojima
  • THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES
    Publication number: 20130201616
    Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.
    Type: Application
    Filed: August 27, 2012
    Publication date: August 8, 2013
    Applicant: Apple Inc.
    Inventors: Shawn X. ARNOLD, Douglas P. Kidd, Sean A. Mayo, Scott P. Mullins, Dennis R. Pyper, Jeffrey M. Thoma, Kenyu Tojima
  • THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES
    Publication number: 20130201615
    Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.
    Type: Application
    Filed: August 22, 2012
    Publication date: August 8, 2013
    Applicant: APPLE INC.
    Inventors: Shawn X. ARNOLD, Douglas P. KIDD, Sean A. MAYO, Scott P. MULLINS, Dennis R. PYPER, Jeffrey M. THOMA, Kenyu TOJIMA