Patents by Inventor Kenzi Kobayashi

Kenzi Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package having locating mechanism for properly positioning semiconductor device within package
    Patent number: 5311402
    Abstract: A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or bottom thereof. To accurately position the chip on the circuit board, the circuit board is provided with a groove or a shoulder in a position where it faces the edges of the open end of the cap. After the chip has been positioned on the circuit board, the cap is bonded to the circuit board via the groove or the shoulder.
    Type: Grant
    Filed: February 12, 1993
    Date of Patent: May 10, 1994
    Assignee: NEC Corporation
    Inventors: Kenzi Kobayashi, Hajime Mori, Yukio Yamaguti