Patents by Inventor Kenzo Isozaki

Kenzo Isozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6862003
    Abstract: A chip antenna that is simple in structure, produces small variation in antenna characteristics between individual antennas, and requires no circuit adjustments, is excellent in productivity. The chip antenna is capable of being mounted on a circuit board, as well as a wireless terminal using the chip antenna. A method of fabricating the chip antenna. A core body is made from an insulating material in a quadrangular or circular cylinder shape. A conductor in a helical shape is mounted on the side surface of the core body. A terminal portion is provided on the core body and electrically connected with an end portion of the conductor. The width, depth, and length of the core body are within ranges of 0.5-5 mm, 0.5-5 mm, and 4-40 mm, respectively. Intrinsic volume resistance and relative dielectric constant of the material are 1013 ?·m or above and 40 or below, respectively.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: March 1, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Makoto Yoshinomoto, Hiromi Sakita, Kenzo Isozaki, Kengo Shiiba, Kazuhide Goto, Mitsuo Kanmera, Masanobu Kuroki, Katsumi Sasaki
  • Patent number: 6621378
    Abstract: A filter includes a substrate with a relative dielectric constant of 200 or less and a thickness of 0.1 mm or more. A first electrode is disposed on at least one surface of the substrate, a group of second electrodes is disposed on at least the other surface of the substrate. Each of the second electrodes is not in contact with each other and is not in contact with the first electrode. The filter also includes a chip type inductance element. The chip type inductance element has an inductance ranging from 0.1 nH to 30 nH and has dimensions of L1 in length, L2 in width and L3 in height, which satisfy the following conditions; 0.3 mm<L1<2.1 mm 0.1 mm<L2<1.1 mm 0.1 mm<L3<1.1 mm.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: September 16, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takumi Naruse, Kuniaki Kiyosue, Hiromi Sakita, Kenzo Isozaki, Kazuhiro Eguchi, Katsumi Sasaki
  • Patent number: 6609009
    Abstract: An electronic component which comprises a substrate, conductive film on the surface of the substrate, a groove created on the conductive film, a protective material covering the groove, and terminals and on both ends of the substrate. Lengths P1 to P8 of the terminals and, the surface roughness and materials of the terminals and, and configuration of the protective material are specified for providing an electronic component and radio terminal with at least one of improved productivity, mountability, and characteristics.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: August 19, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kuniaki Kiyosue, Kazuhiro Takeda, Hiromi Sakita, Kenzo Isozaki, Katsumi Sasaki
  • Patent number: 6556122
    Abstract: A thermal fuse reduced in size and thickness can be obtained. Further, the thermal fuse will not be degraded in characteristics, productivity, reliability, quality, etc. even after reduction in size and thickness. The thermal fuse includes a fuse main body including a substrate, a fusible metal and a cover, and paired terminals disposed protruding from the fuse main body. The other end of the first terminal has a first fusible metal connection, and the other end of the second terminal has a second fusible metal connection. The fusible metal is disposed between the first terminal and the second terminal, and one end of the fusible metal is connected to the first fusible metal connection, and the other end of the fusible metal is connected to the second fusible metal connection. The cover is disposed so as to cover the fusible metal, the first fusible metal connection, and the second fusible metal connection.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: April 29, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Publication number: 20030011532
    Abstract: A chip antenna that is simple in structure, produces small variation in antenna characteristics between individual antennas, and requires no circuit adjustments, is excellent in productivity. The chip antenna is capable of being mounted on a circuit board, as well as a wireless terminal using the chip antenna. A method of fabricating the chip antenna. A core body is made from an insulating material in a quadrangular or circular cylinder shape. A conductor in a helical shape is mounted on the side surface of the core body. A terminal portion is provided on the core body and electrically connected with an end portion of the conductor. The width, depth, and length of the core body are within ranges of 0.5-5 mm, 0.5-5 mm, and 4-40 mm, respectively. Intrinsic volume resistance and relative dielectric constant of the material are 1013 &OHgr;·m or above and 40 or below, respectively.
    Type: Application
    Filed: September 17, 2002
    Publication date: January 16, 2003
    Inventors: Makoto Yoshinomoto, Hiromi Sakita, Kenzo Isozaki, Kengo Shiiba, Kazuhide Goto, Mitsuo Kanmera, Masanobu Kuroki, Katsumi Sasaki
  • Patent number: 6486853
    Abstract: A chip antenna that is simple in structure, produces small variation in antenna characteristics between individual antennas, and requires no circuit adjustments, is excellent in productivity. The chip antenna is capable of being mounted on a circuit board, as well as a wireless terminal using the chip antenna. A method of fabricating the chip antenna. A core body is made from an insulating material in a quadrangular or circular cylinder shape. A conductor in a helical shape is mounted on the side surface of the core body. A terminal portion is provided on the core body and electrically connected with an end portion of the conductor. The width, depth, and length of the core body are within ranges of 0.5-5 mm, 0.5-5 mm, and 4-40 mm, respectively. Intrinsic volume resistance and relative dielectric constant of the material are 1013&OHgr;·m or above and 40 or below, respectively.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: November 26, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Makoto Yoshinomoto, Hiromi Sakita, Kenzo Isozaki, Kengo Shiiba, Kazuhide Goto, Mitsuo Kanmera, Masanobu Kuroki, Katsumi Sasaki
  • Publication number: 20020113685
    Abstract: A thermal fuse reduced in size and thickness can be obtained. Further, the thermal fuse will not be degraded in characteristics, productivity, reliability, quality, etc. even after reduction in size and thickness. The thermal fuse includes a fuse main body including a substrate, a fusible metal and a cover, and paired terminals disposed protruding from the fuse main body. The other end of the first terminal has a first fusible metal connection, and the other end of the second terminal has a second fusible metal connection. The fusible metal is disposed between the first terminal and the second terminal, and one end of the fusible metal is connected to the first fusible metal connection, and the other end of the fusible metal is connected to the second fusible metal connection. The cover is disposed so as to cover the fusible metal, the first fusible metal connection, and the second fusible metal connection.
    Type: Application
    Filed: July 20, 2001
    Publication date: August 22, 2002
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Patent number: 6437676
    Abstract: An inductance element providing a high Q factor even with a dawn-sized configuration comprises a column shape body (7), a coil (13) wound around the body (7), a terminal electrode provided at both ends of the body (7), connected with the coil (13), and a protection material (16) for covering the coil (13), which has a relative dielectric constant not higher than 6.0.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: August 20, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiro Takeda, Kuniaki Kiyosue, Hiromi Sakita, Masanobu Kuroki, Mitsuo Kanmera, Kenzo Isozaki
  • Publication number: 20020033778
    Abstract: A chip antenna simple in structure, producing small variation in antenna characteristics between individual antennas, requiring no circuit adjustments, excellent in productivity, and capable of being mounted on a circuit board, as well as a wireless terminal using the same and a method of fabricating the same. A core body is made from an insulating material in a quadrangular or circular cylinder shape. A conductor in a helical shape is mounted on the side surface of the core body. A terminal portion is provided on the core body and electrically connected with an end portion of the conductor. The width, depth, and height of the core body are within ranges of 0.5-5 mm, 0.5-5 mm, and 4-40 mm, respectively. Intrinsic volume resistance and relative dielectric constant of the material are 1013 &OHgr;·m or above and 40 or below, respectively.
    Type: Application
    Filed: May 16, 2001
    Publication date: March 21, 2002
    Inventors: Makoto Yoshinomoto, Hiromi Sakita, Kenzo Isozaki, Kengo Shiiba, Kazuhide Goto, Mitsuo Kanmera, Masanobu Kuroki, Katsumi Sasaki
  • Publication number: 20020021191
    Abstract: A filter of the present invention comprises a substrate with a relative dielectric constant of 200 or less and thickness of 0.1 mm or more, a first electrode disposed on at least one surface of the substrate, a group of second electrode disposed on at least the other surface of the substrate, each of the group of second electrodes being not in contact with each other and also being not in contact with the first electrode, and a chip type inductance element. The chip type inductance element has an inductance ranging from 0.1 nH to 30 nH and has dimensions of L1 in length, L2 in width and L3 in height, which satisfy the following conditions.
    Type: Application
    Filed: June 12, 2001
    Publication date: February 21, 2002
    Inventors: Takumi Naruse, Kuniaki Kiyosue, Hiromi Sakita, Kenzo Isozaki, Kazuhiro Eguchi, Katsumi Sasaki
  • Patent number: D482004
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: November 11, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Patent number: D492261
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: June 29, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki