Patents by Inventor Kenzo Yoshimori

Kenzo Yoshimori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin sealing type semiconductor device that includes a plurality of leads and method of making the same
    Patent number: 6133623
    Abstract: A resin sealing type semiconductor device comprises an element mounting member (10) having an element mounting surface (12), a semiconductor element (20) bonded to the element mounting surface (12), a plurality of leads (30) provided and separated from the semiconductor element (20), a frame lead (36) disposed between these leads (30) and the semiconductor element (20), various wires (40) and a resin sealing portion which seals the element mounting member (10), the semiconductor element (20), parts of the leads (30) and the frame lead (36). The leads (30) include first inner leads (32a) disposed discontinuously with the frame lead (36) and second leads (32b) disposed integrally with the frame lead (36).The resin sealing type semiconductor device has good heat radiation characteristics and high reliability. Wire bonding with a highly flexible wiring arrangement design is provided by using leads commonly.
    Type: Grant
    Filed: February 25, 1998
    Date of Patent: October 17, 2000
    Assignee: Seiko Epson Corporation
    Inventors: Tetsuya Otsuki, Kenzo Yoshimori