Patents by Inventor Keon Jae Lee
Keon Jae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20170309733Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: ApplicationFiled: June 30, 2017Publication date: October 26, 2017Inventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
-
Publication number: 20170299426Abstract: Disclosed is a piezoelectric voice recognition sensor, which includes a flexible thin film, a piezoelectric material layer laminated on the flexible thin film, and an electrode laminated on the piezoelectric material layer, wherein the electrode includes a plurality of frequency separation channels arranged in a row, and the plurality of frequency separation channels have different lengths from each other. The piezoelectric voice recognition sensor separates a voice, recognized using a plurality of frequency separation channels having a trapezoidal shape, through the plurality of channels depending on frequencies, and simultaneously converts the separated voice signals from mechanical vibration signals into electric signals by means of the flexible piezoelectric element so that the converted electric signals are recognized.Type: ApplicationFiled: June 9, 2016Publication date: October 19, 2017Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Keon Jae Lee, Jae Hyun Han, Daniel Joe
-
Patent number: 9768086Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: GrantFiled: March 29, 2016Date of Patent: September 19, 2017Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOISInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
-
Patent number: 9761444Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: GrantFiled: March 29, 2016Date of Patent: September 12, 2017Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOISInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
-
Publication number: 20160293794Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: ApplicationFiled: March 29, 2016Publication date: October 6, 2016Inventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
-
Publication number: 20160284544Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: ApplicationFiled: March 29, 2016Publication date: September 29, 2016Inventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
-
Patent number: 9450043Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: GrantFiled: January 14, 2014Date of Patent: September 20, 2016Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOISInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
-
Publication number: 20160223842Abstract: One aspect of the present disclosure relates to a remotely controllable lens device. The lens device can include a lens material and a circuit physically coupled to the lens material. The circuit can be configured to be powered based on an energy signal from a power source to perform a function (e.g., release of drug, generation of electromagnetic radiation, detection of electromagnetic radiation, and/or control of an optical refractive property). For example, the power source can be an external power source and/or an auto-powered source. The external power source can be, for example, a power source that utilizes synchronized magnetic flux phase coupling (e.g., WiTricity). The auto-powered source can be provided on-site (e.g., on-chip) using a harvesting system (e.g., solar-cell, photo-cell, piezoelectric, etc.Type: ApplicationFiled: September 9, 2014Publication date: August 4, 2016Inventors: Seok-Hyun Yun, Ehsan Kamrani, Sei Kwang Hahn, Hyemin Kim, Dohee Keum, Keon Jae Lee, Choun-Ki Joo
-
Publication number: 20150224324Abstract: Provided is a method for separating a nanogenerator, which includes laminating a buffer layer on a sacrificial substrate, making a nanogenerator on the buffer layer, laminating a metal layer on the nanogenerator and separating the nanogenerator from the buffer layer. Here, a nanogenerator is separated by using a stress difference between the sacrificial substrate and the metal layer, instead of an existing method in which a nanogenerator is separated from the sacrificial substrate by means of wet etching or the like. In particular, according to a difference between a tensile stress at the metal layer such as nickel and a compressive stress at the lower silicon substrate, the nanogenerator is intactly separated from the silicon oxide layer serving as a buffer layer. Therefore, the nanogenerator may be separated from the sacrificial substrate in a mechanical way, which is safer and more economic in comparison to an existing chemical separation method using an etching solution.Type: ApplicationFiled: November 11, 2014Publication date: August 13, 2015Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Keon Jae LEE, Myung Hwan Byun, Kwi II Park, Geon Tae Hwang, Chang Kyu Chung
-
Publication number: 20150077949Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.Type: ApplicationFiled: September 5, 2014Publication date: March 19, 2015Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Kyung Wook Baek, Keon Jae Lee, Geon Tae Hwang, Hyeon Kyun Yoo, Do Hyun Kim, Yoo Sun Kim
-
Patent number: 8980673Abstract: Provided are a solar cell and a method of manufacturing the same. The method of manufacturing the solar cell includes stacking a solar cell device layer containing GaN on a sacrificial substrate, etching the solar cell device layer to expose the sacrificial substrate, thereby forming one or more solar cell devices comprising the solar cell device layer, anisotropically etching the exposed sacrificial substrate, contacting the solar cell devices to a stamping processor to remove the solar cell devices from the sacrificial substrate, and transferring the solar cell devices onto a receiving substrate. A high temperature semiconductor process may be performed on a substrate such as a silicon substrate to transfer the solar cell devices onto the substrate, thereby manufacturing flexible solar cells. Also, a large number of solar cells may be excellently aligned on a large area. In addition, economical solar cells may be manufactured.Type: GrantFiled: January 30, 2014Date of Patent: March 17, 2015Assignees: LG Siltron Incorporated, Korea Advanced Institute of ScienceInventors: Keon Jae Lee, Sang Yong Lee, Seung Jun Kim
-
Patent number: 8822970Abstract: Provided are a phase-change memory device using insulating nanoparticles, a flexible phase-change memory device and a method for manufacturing the same. The phase-change memory device includes an electrode, and a phase-change layer in which a phase change occurs depending on heat generated from the electrode, wherein insulating nanoparticles formed from a self-assembled block copolymer are provided between the electrode and the phase-change layer undergoing crystallization and amorphization.Type: GrantFiled: February 21, 2012Date of Patent: September 2, 2014Assignee: Korea Advanced Institute of Science and Technology (KAIST)Inventors: Yeon Sik Jung, Keon Jae Lee, Jae Won Jeong, Jae Suk Choi, Geon Tae Hwang, Beom Ho Mun, Byoung Kuk You, Seung Jun Kim
-
Patent number: 8808860Abstract: The present invention relates to a 3-dimensional nanostructure having nanomaterials stacked on a graphene substrate; and more specifically, to a 3-dimensional nanostructure having at least one nanomaterial selected from nanotubes, nanowires, nanorods, nanoneedles and nanoparticles grown on a reduced graphene substrate. The present invention enables the achievement of a synergy effect of the 3-dimensional nanostructure hybridizing 1-dimensional nanomaterials and 2-dimensional graphene. The nanostructure according to the present invention is excellent in flexibility and elasticity, and can easily be transferred to any substrate having a non-planar surface. Also, all junctions in nanomaterials, a metal catalyst and a graphene film system form the ohmic electrical contact, which allows the nanostructure to easily be incorporated into a field-emitting device.Type: GrantFiled: September 20, 2010Date of Patent: August 19, 2014Assignee: Korea Advanced Institute of Science and TechnologyInventors: Sang Ouk Kim, Won Jong Lee, Duck Hyun Lee, Tae Hee Han, Ji Eun Kim, Jin Ah Lee, Keon Jae Lee
-
Patent number: 8803406Abstract: There are provided a flexible nanocomposite generator and a method of manufacturing the same. A flexible nanocomposite generator according to the present invention includes a piezoelectric layer formed of a flexible matrix containing piezoelectric nanoparticles and carbon nanostructures; and electrode layers disposed on the upper and lower surfaces of both sides of the piezoelectric layer, in which according to a method for manufacturing a flexible nanocomposite generator according to the present invention and a flexible nanogenerator, it is possible to manufacture a flexible nanogenerator with a large area and a small thickness. Therefore, the nanogenerator may be used as a portion of a fiber or cloth. Accordingly, the nanogenerator according to the present invention generates power in accordance with bending of attached cloth, such that it is possible to continuously generate power in accordance with movement of a human body.Type: GrantFiled: November 30, 2011Date of Patent: August 12, 2014Assignee: KAIST (Korea Advanced Institute of Science and Technology)Inventors: Keon Jae Lee, Kwi-Il Park, Do Kyung Kim, Sang Ouk Kim, Geon-Tae Hwang
-
Publication number: 20140191236Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: ApplicationFiled: January 14, 2014Publication date: July 10, 2014Applicant: The Board of Trustees of the University of IIIinoisInventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
-
Publication number: 20140147957Abstract: Provided are a solar cell and a method of manufacturing the same. The method of manufacturing the solar cell includes stacking a solar cell device layer containing GaN on a sacrificial substrate, etching the solar cell device layer to expose the sacrificial substrate, thereby forming one or more solar cell devices comprising the solar cell device layer, anisotropically etching the exposed sacrificial substrate, contacting the solar cell devices to a stamping processor to remove the solar cell devices from the sacrificial substrate, and transferring the solar cell devices onto a receiving substrate. A high temperature semiconductor process may be performed on a substrate such as a silicon substrate to transfer the solar cell devices onto the substrate, thereby manufacturing flexible solar cells. Also, a large number of solar cells may be excellently aligned on a large area. In addition, economical solar cells may be manufactured.Type: ApplicationFiled: January 30, 2014Publication date: May 29, 2014Applicants: Korea Advanced Institute of Science, L G Siltron Inc.Inventors: Keon Jae Lee, Sang Yong Lee, Seung Jun Kim
-
Patent number: 8664699Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: GrantFiled: March 13, 2013Date of Patent: March 4, 2014Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
-
Patent number: 8661634Abstract: A method of manufacturing a flexible piezoelectric device including laminating a first metal layer on a silicon oxide layer on a silicon substrate. The method further includes laminating a device on the first metal layer and annealing the first metal layer to oxidize the first metal into a first metal oxide. The method further includes etching the first metal oxide to separate the device from the silicon oxide layer and transferring the separated device to a flexible substrate using a transfer layer. The metal oxide layer laminated on the silicon substrate is etched to separate the device from the substrate. As a result, physical damage of the silicon substrate is prevented and a cost of using expensive single-crystal silicon substrate is reduced.Type: GrantFiled: March 24, 2010Date of Patent: March 4, 2014Assignee: KAIST (Korea Advanced Institute of Science and TechnologyInventors: Keon Jae Lee, Suk Joong L. Kang, Jaemyung Chang, Kwi-il Park, Seungjun Kim, Sang Yong Lee
-
Patent number: 8557619Abstract: A method of manufacturing LED display is provided. The method provides a sacrificial substrate on which RGB LED device layers are formed, respectively. The method etches and patterns the LED device layer to manufacture RGB LED devices, respectively. The method removes the sacrificial substrate in a lower side of the LED device. The method contacts a stamping processor to the RGB LED devices to separate the RGB LED devices from the sacrificial substrate. The method transfers the LED device, which is attached to the stamping processor, to a receiving substrate.Type: GrantFiled: August 7, 2010Date of Patent: October 15, 2013Assignee: Siltron Inc.Inventors: Keon Jae Lee, Sang Yong Lee, Seung Jun Kim
-
Patent number: 8482041Abstract: In contrast to a conventional planar CMOS technique in design and fabrication for a field-effect transistor (FET), the present invention provides an SGT CMOS device formed on a conventional substrate using various crystal planes in association with a channel type and a pillar shape of an FET, without a need for a complicated device fabrication process. Further, differently from a design technique of changing a surface orientation in each planar FET, the present invention is designed to change a surface orientation in each SGT to achieve improvement in carrier mobility. Thus, a plurality of SGTs having various crystal planes can be formed on a common substrate to achieve a plurality of different carrier mobilities so as to obtain desired performance.Type: GrantFiled: March 6, 2012Date of Patent: July 9, 2013Assignee: Unisantis Electronics Singapore Pte Ltd.Inventors: Fujio Masuoka, Keon Jae Lee