Abstract: A liquid crystal device comprises a first polymer substrate, a first buffer layer, thin film transistors, a liquid crystal layer and a second polymer substrate. The first buffer layer is disposed on the first polymer substrate. The thin film transistors are disposed on the first buffer layer. The liquid crystal layer is disposed on the thin film transistors. The second polymer substrate is disposed on the liquid crystal layer.

Abstract: A light-emitting device and display equipment are disclosed. The light-emitting device includes a light-emitting unit. The light-emitting unit includes a driving transistor and a light-emitting diode. The driving transistor includes a first terminal, a second terminal and a gate terminal. The first terminal is used to receive an operation voltage. The light-emitting diode is coupled to the second terminal and used to receive a driving current. The operation voltage is variable.

Abstract: A light-emitting device is provided, including a light-emitting unit and an optical layer. The light-emitting unit includes a light-emitting chip and an encapsulation disposed thereon. The optical layer is disposed on the light-emitting unit, the optical layer having a first region overlapping the light-emitting chip in a top view direction of the light-emitting device and a second region not overlapping the light-emitting chip in the top view direction of the light-emitting device, wherein the transmittance of the first region is less than the transmittance of the second region.

Abstract: An electronic device is provided. The electronic device includes a substrate and an electronic unit disposed on the substrate. The electronic unit includes a light-emitting diode, a conductive structure, a first driving circuit, and a second driving circuit. The conductive structure is disposed between the light-emitting diode and the substrate. The first driving circuit includes a first output wire. The second driving circuit includes a second output wire. The first driving circuit is electrically connected to the light-emitting diode by the conductive structure. The second driving circuit is electrically insulated from the light-emitting diode. In addition, the conductive structure at least partially overlaps the first output wire and the second output wire in a normal direction of the substrate.

Abstract: An electronic device is provided in the present disclosure. The electronic device includes a substrate, a driving layer, an organic layer and a light emitting layer. The driving layer is disposed on the substrate. The organic layer is disposed on the driving layer, and the organic layer includes a through hole portion. The light emitting unit is disposed on the organic layer. The light emitting unit is electrically connected to the driving layer by a bonding pad. A ratio of an area of the through hole portion overlapped with the bonding pad to and area of the bonding pad is greater than or equal to 0.3 and less than or equal to 3 in a top view direction of the electronic device.

Abstract: An electric device may include a first group and a first signal line coupled to the first group. The first group may include a first light-emitting diode (LED), a second LED and a first control circuit. The first LED and the second LED are coupled in series. The first control circuit is coupled to the first LED and the second LED for turning on one of the first LED and the second LED in a first mode, and turning on the first LED and the second LED in a second mode. Number of LEDs enabled in the first mode is less than number of LEDs enabled in the second mode.

Abstract: A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 ?m to 10 ?m. A high-frequency device is also provided.

Abstract: An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.

Abstract: Some embodiments of the present disclosure provide a light-emitting diode package. The light-emitting diode package includes a transparent substrate. The light-emitting diode package also includes a first light-emitting diode which is disposed on the transparent substrate and has a first multiple quantum well structure. The light-emitting diode package further includes a second light-emitting diode which is disposed on the transparent substrate and has a second multiple quantum well structure. The first multiple quantum well structure and the second multiple quantum well structure are disposed to emit lights with different wavelengths.

Abstract: An antenna device includes a first dielectric substrate, a first radiator disposed on the first dielectric substrate, a second dielectric substrate disposed on the first radiator, a second radiator disposed between the first dielectric substrate and the second dielectric substrate, a main radiator, disposed on the second dielectric substrate, and a modulation structure located between a first radiation portion of the first radiator and a second radiation portion of the second radiator. The first radiation portion, the modulation structure, and the second radiation portion are located in a central area.

Abstract: A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 ?m to 10 ?m. A high-frequency device is also provided.

Abstract: An electronic device includes a first sub-pixel and a test element. The first sub-pixel includes a first transistor, and a first electronic unit. The first electronic unit is electrically connected to the first transistor. The test element is electrically connected to the first transistor. The test element has a first impedance, the first electronic unit has a second impedance, and the first impedance is higher than the second impedance.

Abstract: An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.

Abstract: An electronic device includes a substrate and a plurality of light-emitting driving circuits. The plurality of light-emitting driving circuits are disposed on the substrate. Each of the plurality of light-emitting driving circuits includes a switch component and a pulse modulation unit. The switch component has a first terminal and a second terminal. The first terminal of the switch component is coupled to a comparison signal line. The pulse modulation unit has a first terminal and a second terminal. The first terminal of the pulse modulation unit is coupled to a data line, and the second terminal of the pulse modulation unit is coupled to the second terminal of the switch component.

Abstract: An electronic device is provided. The electronic device includes a substrate and an electronic unit disposed on the substrate. The electronic unit includes a light-emitting diode, a conductive structure, a first driving circuit, and a second driving circuit. The conductive structure is disposed between the light-emitting diode and the substrate. The first driving circuit includes a first output wire. The second driving circuit includes a second output wire. The first driving circuit is electrically connected to the light-emitting diode by the conductive structure. The second driving circuit is electrically insulated from the light-emitting diode. In addition, the conductive structure at least partially overlaps the first output wire and the second output wire in a normal direction of the substrate.

Abstract: A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

Abstract: The present disclosure provides an electronic device providing a substrate, a first circuit, a plurality of bonding pads and a light emitting unit. The first circuit is disposed on the substrate. The bonding pads are disposed on the substrate, wherein at least one of the bonding pads includes a bonding part and a connecting part, and the bonding part is electrically connected to the first circuit through the connecting part. The light emitting unit is disposed on the substrate and corresponding to the bonding part, and the light emitting unit is electrically connected to the first circuit through at least one of the bonding pads. At least a portion of the first circuit is located between two of the bonding pads in a top view.

Abstract: A microwave modulation device includes a first radiator, a second radiator and a modulation structure. The first radiator includes a substrate; a metal layer disposed on the substrate; a protective layer disposed on at least a portion of the metal layer and including a through hole overlapping with at least a portion of the metal layer; and an etch stop layer disposed between the metal layer and the protective layer. The second radiator disposed corresponding to the first radiator. The modulation structure is disposed between the first radiator and the second radiator.

Abstract: A display device includes a pixel array, multiple data lines and multiple gate lines. The pixel array includes multiple pixels. At least one of the pixels includes a first sub-pixel and a second sub-pixel. The first sub-pixel includes a pixel circuit, which includes a first light-emitting element and a first driving circuit. The first driving circuit is coupled to and configured to control the first light-emitting element. The first driving circuit includes multiple TFTs. The second sub-pixel includes a pixel circuit, which includes a second light-emitting element and a second driving circuit. The second driving circuit is coupled to and configured to control the second light-emitting element. The second driving circuit includes multiple TFTs. The number of TFTs of the first driving circuit and the number of TFTs of the second driving circuit are different.

Abstract: An electric device may include a first group and a first signal line coupled to the first group. The first group may include a first light-emitting diode (LED), a second LED and a first control circuit. The first LED and the second LED are coupled in series. The first control circuit is coupled to the first LED and the second LED for turning on one of the first LED and the second LED in a first mode, and turning on the first LED and the second LED in a second mode. Number of LEDs enabled in the first mode is less than number of LEDs enabled in the second mode.