Abstract: An electronics systems having variable interconnections among major components is tested by dynamically identifying the locations and types of all system components at the time the test is to be performed, for building a global model describing the interconnections among these components. Specific tests appropriate for this model are then dynamically generated and executed. Data on the components themselves identifies them. The tests employ boundary-scanning techniques to locate failing drivers, receivers, and bidirectional driver/receivers, as well as open and shorted interconnections.