Patents by Inventor Keum Yong SEONG

Keum Yong SEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240050622
    Abstract: The present invention relates to a photocurable hemostatic composition and, specifically, to a photocurable liquid hemostatic composition containing a hyaluronic acid-based photocrosslinkable compound and a photoinitiator as active ingredients, and to a hemostatic agent of a film or sponge formulation freeze-dried from the composition, wherein, by increasing the degree of substitution of a photocrosslinkable functional group, the composition can quickly form a gel or a film adhesive layer within a few seconds during light radiation, and the resulting gel remains in a body more stably for a long time, thus enhancing hemostasis and tissue regeneration effects.
    Type: Application
    Filed: November 15, 2021
    Publication date: February 15, 2024
    Applicants: PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, SNVIA CO., LTD.
    Inventors: Seung Yun YANG, Hyeseon LEE, Keum-Yong SEONG, Samdae PARK, Kang Oh LEE
  • Publication number: 20210354343
    Abstract: Disclosed is an apparatus for manufacturing a microneedle patch, including: a silicon mold mounted on an upper surface to mold a material for the microneedle patch; a carrier of which the silicon mold is mounted on an inside of the upper surface; an upper block which is assembled with the carrier to form a chamber in which the material and the silicon mold are accommodated; an air cylinder which is connected to the upper surface of the upper block to transmit power so that the upper block descends to be assembled with the carrier and ascends to be separated from the carrier; and a pressing portion which is connected to a side surface of the upper block so as to press the chamber or ventilate the chamber while the upper block and the carrier are assembled with each other.
    Type: Application
    Filed: May 18, 2020
    Publication date: November 18, 2021
    Applicant: SNVIA Co., Ltd.
    Inventors: Kang Oh LEE, Seung Soo LEE, Seung Yun YANG, Keum-Yong SEONG, Sodam KIM
  • Patent number: 10869905
    Abstract: In a composition and a microneedle for a localized obesity treatment containing the same in accordance with the present disclosure, the composition in accordance with the present disclosure contains a gelatin, decomposes a fat in a body, and inhibits lipogenesis and fat deposition in the body.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: December 22, 2020
    Assignee: PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
    Inventors: Seung Yun Yang, Beum Soo An, Keum Yong Seong, Sung Min An
  • Publication number: 20190192611
    Abstract: In a composition and a microneedle for a localized obesity treatment containing the same in accordance with the present disclosure, the composition in accordance with the present disclosure contains a gelatin, decomposes a fat in a body, and inhibits lipogenesis and fat deposition in the body.
    Type: Application
    Filed: August 29, 2017
    Publication date: June 27, 2019
    Inventors: Seung Yun YANG, Beum Soo AN, Keum Yong SEONG, Sung Min AN
  • Publication number: 20190184149
    Abstract: A microneedle patch includes: a patch layer which is a flat layer; and a microneedle which is disposed on one surface of the patch layer, includes an air-pocket therein, and formed of a polymer having at least one of swellability and solubility. The air-pocket is disposed in a lower end of the microneedle which is in contact with the patch layer. The patch layer includes a needle layer on one surface of the patch layer, and the microneedle is disposed on an opposite surface to one surface of the needle layer which is in contact with the patch layer.
    Type: Application
    Filed: July 31, 2017
    Publication date: June 20, 2019
    Applicant: Pusan National University Industry-University Cooperation Foundation
    Inventors: Seung Yun YANG, Keum Yong SEONG