Abstract: A display device capable of switching image sources and including a first transmission interface, a second transmission interface, a system on chip (SOC), and a display panel is provided. The first transmission interface is configured to be coupled to a first electronic device and receive a first image signal and selection information from the first electronic device. The second transmission interface is configured to be coupled to a second electronic device and receive a second image signal from the second electronic device. The SOC selects at least one of the first and second image signals according to the selection information to generate a display signal. The display panel displays an image according to the display signal.

Abstract: A display device is capable of switching between image sources and includes a first transmission interface, a second transmission interface, a first peripheral interface, a system on chip (SOC) and a display panel. The first transmission interface is configured to be coupled to a first electronic device and receive a first image signal from the first electronic device. The second transmission interface is configured to be coupled to a second electronic device and receive a second image signal from the second electronic device. The first peripheral interface is configured to be coupled to a first peripheral device providing input information. The SOC selects at least one of the first and second image signals according to the input information to generate a display signal. The display panel displays an image according to the display signal.

Abstract: A display device is capable of switching between image sources and includes a first transmission interface, a second transmission interface, a first peripheral interface, a system on chip (SOC) and a display panel. The first transmission interface is configured to be coupled to a first electronic device and receive a first image signal from the first electronic device. The second transmission interface is configured to be coupled to a second electronic device and receive a second image signal from the second electronic device. The first peripheral interface is configured to be coupled to a first peripheral device providing input information. The SOC selects at least one of the first and second image signals according to the input information to generate a display signal. The display panel displays an image according to the display signal.

Abstract: A display device capable of switching image sources and including a first transmission interface, a second transmission interface, a system on chip (SOC), and a display panel is provided. The first transmission interface is configured to be coupled to a first electronic device and receive a first image signal and selection information from the first electronic device. The second transmission interface is configured to be coupled to a second electronic device and receive a second image signal from the second electronic device. The SOC selects at least one of the first and second image signals according to the selection information to generate a display signal. The display panel displays an image according to the display signal.

Abstract: An array of semiconductor components, comprising a first plurality of semiconductor components and a second plurality of semiconductor components held on a carrier, is bonded onto one or more substrates. The first plurality of semiconductor components is first located for pick-up by a transfer device, and each semiconductor component comprised in the first plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates. After the first plurality of semiconductor components have been picked up and bonded, the carrier is rotated and the second plurality of semiconductor components is located for pick-up by the transfer device. Thereafter, each semiconductor component comprised in the second plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates.

Abstract: Multiple types of adhesives contained in separate containers are transferred from a supply of adhesives to a substrate. A first stamping pin is moved to a position of a first container containing a first adhesive, and the first adhesive is transferred with the first stamping pin from the first container to the substrate before bonding a first die onto the first adhesive. A second stamping pin is then moved to a position of a second container containing a second adhesive, and the second adhesive is transferred with the second stamping pin from the second container to the substrate before bonding a second die onto the second adhesive.

Abstract: An array of semiconductor components, comprising a first plurality of semiconductor components and a second plurality of semiconductor components held on a carrier, is bonded onto one or more substrates. The first plurality of semiconductor components is first located for pick-up by a transfer device, and each semiconductor component comprised in the first plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates. After the first plurality of semiconductor components have been picked up and bonded, the carrier is rotated and the second plurality of semiconductor components is located for pick-up by the transfer device. Thereafter, each semiconductor component comprised in the second plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates.

Abstract: In an electromagnetic valve, a stator assembly includes an electrically energizable coil and a thin-walled core which receives and reciprocally supports an armature. The thin-walled core has a closed end and an open end, the open end being in fluid communication with a fluid flow passage within a valve member. The valve member reciprocates with the armature to control flow rate in the flow passage. A flange integral with the thin-walled core extends about the open end. A washer receives the thin-walled core and abuts the flange. The flange and the washer are received in a recess in the valve body and are permanently and sealingly fixed therein by a swaged joint in the valve body.

Abstract: Multiple types of adhesives contained in separate containers are transferred from a supply of adhesives to a substrate. A first stamping pin is moved to a position of a first container containing a first adhesive, and the first adhesive is transferred with the first stamping pin from the first container to the substrate before bonding a first die onto the first adhesive. A second stamping pin is then moved to a position of a second container containing a second adhesive, and the second adhesive is transferred with the second stamping pin from the second container to the substrate before bonding a second die onto the second adhesive.

Abstract: In an electromagnetic valve, a stator assembly includes an electrically energizable coil and a thin-walled core which receives and reciprocally supports an armature. The thin-walled core has a closed end and an open end, the open end being in fluid communication with a fluid flow passage within a valve member. The valve member reciprocates with the armature to control flow rate in the flow passage. A flange integral with the thin-walled core extends about the open end. A washer receives the thin-walled core and abuts the flange. The flange and the washer are received in a recess in the valve body and are permanently and sealingly fixed therein by a swaged joint in the valve body.

Abstract: A die sorting apparatus for a wafer is provided that associates logical positions of each die from a map file for storing records of testing information based upon testing performed on individual dice comprised in the wafer with its physical position as illustrated by an image acquired by an image capturing device showing physical positions of the dice, after the dice have been singulated. A processing device can thus determine actual physical positions of the dice for reference by a die pick-up device configured to selectively pick up dice that meet predetermined criteria according to the testing information from their actual physical positions as determined.

Abstract: A die sorting apparatus for a wafer is provided that associates logical positions of each die from a map file for storing records of testing information based upon testing performed on individual dice comprised in the wafer with its physical position as illustrated by an image acquired by an image capturing device showing physical positions of the dice, after the dice have been singulated. A processing device can thus determine actual physical positions of the dice for reference by a die pick-up device configured to selectively pick up dice that meet predetermined criteria according to the testing information from their actual physical positions as determined.