Abstract: A method of performing chemical mechanical polish (CMP) processes on a wafer includes providing the wafer; determining a thickness profile of a feature on a surface of the wafer; and, after the step of determining the thickness profile, performing a high-rate CMP process on the feature using a polish recipe to substantially achieve a within-wafer thickness uniformity of the feature. The polish recipe is determined based on the thickness profile.

Abstract: A method for evaluation of optimality of a master production schedule begins by obtaining a forecasted operation schedule, the master production schedule, and an operation completion time. A master production schedule variance is determined from the master production schedule and the operation completion time. Then, a forecasted operation schedule variance is determined from the forecasted operation schedule and the operation completion time. An optimality index is an indicator of the optimality of the master production schedule, which is determined as a function of the operation schedule variance to the forecasted schedule variance. A penalty for deviation of the operation completion time deviation from the master production schedule may be incorporated into the determination. A third embodiment of the method evaluates the concentration/dispersion of the master production schedule variance and provides a better optimality index for a more concentrated distribution of the planned operation index.