Abstract: To avoid VSWR degradation associated with using a fixed impedance matching transformer in an RF power amplifier combiner, the transformer is configured as an adjustable-impedance matching transformer, that maintains a relatively low voltage standing wave ratio at the combiner's output port, as the number of amplifiers is changed. The adjustable impedance transformer may comprise a section of transmission line conductor and an adjacent dielectric medium, the dielectric constant of which is controllably variable. The dielectric medium may comprise a shaped dielectric element, that is positionable relative to the transmission line conductor, so as to provide a variable dielectric constant and thereby allow the effective impedance of the transformer to be varied among respectively different values based upon the number of amplifiers being combined.

Abstract: An ‘orthogonally stacked’ support and cooling architecture for RF signaling circuits includes a plurality of RF amplifier circuit cards mounted on edge-mountable RF printed circuit support and heat dissipation modules, that are affixed to a first side of a base plate, so that the RF circuit cards extend in a direction that is generally orthogonal to the base plate. Arranged on a second side of the base plate are RF distribution networks for the RF circuit cards. The RF signal distribution networks are RF-coupled to the RF printed circuit boards by blind-mating, square post type multi-pin connectors through the base plate. Orienting the RF distribution networks in a plane orthogonal to the RF circuit cards and having the heat exchangers extend into gaps between the modules serves to considerably reduce the size of the architecture.

Abstract: An ‘orthogonally stacked’ support and cooling architecture for RF signaling circuits includes a plurality of RF amplifier circuit cards mounted on edge-mountable RF printed circuit support and heat dissipation modules, that are affixed to a first side of a base plate, so that the RF circuit cards extend in a direction that is generally orthogonal to the base plate. Arranged on a second side of the base plate are RF distribution networks for the RF circuit cards. The RF signal distribution networks are RF-coupled to the RF printed circuit boards by,blind-mating, square post type multi-pin connectors through the base plate. Orienting the RF distribution networks in a plane orthogonal to the RF circuit cards and having the heat exchangers extend into gaps between the modules serves to considerably reduce the size of the architecture.