Patents by Inventor Kevin Canning

Kevin Canning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor - slice cleaving
    Patent number: 5393707
    Abstract: Cleavage of a semiconductor slice is initiated at a peck-mark formed in the upper surface at one edge of the slice by bending the slice over a cutting edge of a semiconductor slice dicing wheel. The cleave is propagated to the far edge of the slice by relative sliding movement of the wheel across the underside of the slice.
    Type: Grant
    Filed: July 19, 1993
    Date of Patent: February 28, 1995
    Assignee: Northern Telecom Limited
    Inventor: Kevin Canning
  • Method of making a single heterostructure laser chip having sawn cavities and secondary saw cuts
    Patent number: 4731344
    Abstract: A sawn cavity single heterostructure laser chip is provided with secondary saw cuts to produce an inverted Tee shaped cross-section in order to limit the width of emission to less than the full width of the chip. The depth of the secondary cuts is arranged to terminate just short of the active region (3).
    Type: Grant
    Filed: March 4, 1986
    Date of Patent: March 15, 1988
    Assignee: STC Plc
    Inventors: Kevin Canning, Alan J. Perryman