Patents by Inventor Kevin E. Wells

Kevin E. Wells has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular printed circuit board electrical integrity and uses
    Patent number: 9900983
    Abstract: Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on one or more layers of the first PCB module. The PCB structure may further include a second PCB module including second structures on one or more layers of the second PCB module. The PCB structure may additionally include a middle layer between the first PCB module and the second PCB module. The middle layer electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: February 20, 2018
    Assignee: Intel Corporation
    Inventors: Kevin E. Wells, Richard C. Stamey
  • Modular printed circuit board
    Patent number: 9829915
    Abstract: Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on one or more layers of the first PCB module. The apparatus may further include a second PCB module with a second pattern of routing structures on one or more layers of the second PCB module. The second pattern of routing structures may be aligned with and electrically coupled to the first pattern of routing structures without connectors. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: November 28, 2017
    Assignee: Intel Corporation
    Inventors: Kevin E. Wells, Richard C. Stamey
  • MODULAR PRINTED CIRCUIT BOARD ELECTRICAL INTEGRITY AND USES
    Publication number: 20160165724
    Abstract: Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on one or more layers of the first PCB module. The PCB structure may further include a second PCB module including second structures on one or more layers of the second PCB module. The PCB structure may additionally include a middle layer between the first PCB module and the second PCB module. The middle layer electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.
    Type: Application
    Filed: February 16, 2016
    Publication date: June 9, 2016
    Inventors: Kevin E. Wells, Richard C. Stamey
  • MODULAR PRINTED CIRCUIT BOARD
    Publication number: 20150373847
    Abstract: Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on one or more layers of the first PCB module. The apparatus may further include a second PCB module with a second pattern of routing structures on one or more layers of the second PCB module. The second pattern of routing structures may be aligned with and electrically coupled to the first pattern of routing structures without connectors. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 25, 2014
    Publication date: December 24, 2015
    Inventors: Kevin E. Wells, Richard C. Stamey
  • Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
    Patent number: 7282796
    Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: October 16, 2007
    Assignee: Intel Corporation
    Inventors: Kuljeet Singh, Kevin E. Wells, Julius Delino
  • Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts
    Patent number: 7064431
    Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: June 20, 2006
    Assignee: Intel Corporation
    Inventors: Kuljeet Singh, Kevin E. Wells, Julius Delino
  • Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
    Patent number: 6885102
    Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: April 26, 2005
    Assignee: Intel Corporation
    Inventors: Kuljeet Singh, Kevin E. Wells, Julius Delino
  • Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
    Publication number: 20040036176
    Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.
    Type: Application
    Filed: August 26, 2002
    Publication date: February 26, 2004
    Inventors: Kuljeet Singh, Kevin E. Wells, Julius Delino
  • Method and apparatus for retaining cooling apparatus and bus bar
    Patent number: 6606246
    Abstract: A method and apparatus for retaining a cooling apparatus in engagement with an integrated circuit including a frame with a bus bar carrying an electrical signal from one part of a circuitboard to which the frame and the integrated circuit are attached to another part the circuitboard.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: August 12, 2003
    Assignee: Intel Corporation
    Inventor: Kevin E. Wells
  • METHOD AND APPARATUS FOR RETAINING COOLING APPARATUS AND BUS BAR
    Publication number: 20030058621
    Abstract: A method and apparatus for retaining a cooling apparatus in engagement with an integrated circuit including a frame with a bus bar carrying an electrical signal from one part of a circuitboard to which the frame and the integrated circuit are attached to another part the circuitboard.
    Type: Application
    Filed: September 21, 2001
    Publication date: March 27, 2003
    Inventor: Kevin E. Wells