Patents by Inventor Kevin Edward Lupton

Kevin Edward Lupton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6569931
    Abstract: A thermoplastic elastomer composition, method of preparation, and article prepared therefrom. The thermoplastic elastomer composition comprising (A) a thermoplastic elastomer, (B) a thermoplastic resin which has Rockwell hardness (R scale) exceeding 80 at 25° C., (C) a polydiorganosiloxane which has a Williams plasticity exceeding 100 at 25° C.; and (D) an inorganic filler.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: May 27, 2003
    Assignees: Dow Corning Corporation, Dow Corning Toray Silicone Co., Ltd.
    Inventors: Haruhiko Furukawa, Yoshitsugu Morita, Kevin Edward Lupton, David Joseph Romenesko
  • Publication number: 20030065108
    Abstract: Polymer compositions having improved impact resistance at temperatures below 10° C. comprising a polycarbonate resin and a polyorganosiloxane, and methods for their preparation, are disclosed.
    Type: Application
    Filed: September 20, 2002
    Publication date: April 3, 2003
    Inventors: Jeffery Kurtis Beach, Igor Chorvath, Kevin Edward Lupton
  • Publication number: 20020006998
    Abstract: A thermoplastic elastomer composition, method of preparation, and article prepared therefrom.
    Type: Application
    Filed: May 3, 2001
    Publication date: January 17, 2002
    Inventors: Haruhiko Furukawa, Yoshitsugu Morita, Kevin Edward Lupton, David Joseph Romenesko
  • Patent number: 6013715
    Abstract: There is disclosed a method for preparing a thermoplastic elastomer, said method comprising:(I) mixing(A) a thermoplastic resin selected from the group consisting of a polyolefin and a poly(butylene terephthalate),(B) a diorganopolysiloxane having a plasticity of at least 30 and having an average of at least 2 alkenyl radicals in its molecule,(C) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule,(D) optionally, a reinforcing filler and(E) a hydrozilation catalyst; and(II) dynamically curing said diorganopolysiloxane (B), wherein the amount of said diorganopolysiloxane (B) used is such that at least one property of the thermoplastic elastomer selected from tensile strength or elongation is at least 25% greater than the respective property for a corresponding simple blend wherein said diorganopolysiloxane is not cured.
    Type: Grant
    Filed: March 3, 1998
    Date of Patent: January 11, 2000
    Assignee: Dow Corning Corporation
    Inventors: Gerald Alphonse Gornowicz, Kevin Edward Lupton, David Joseph Romenesko, Kim Struble, Hongxi Zhang
  • Patent number: 6013217
    Abstract: The present invention relates to a method for processing a thermoplastic resin composition by extruding the composition through a nickel die to provide an extrudate having a low degree of surface roughness, said composition comprising(A) 100 parts by weight of a thermoplastic resin;(B) 0.01 to 1 part by weight of a hydroxy-functional diorganopolysiloxane having a number average molecular weight of at least 10,000; and(C) 0.001 to 1 part by weight of an organophosphorous compound.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: January 11, 2000
    Assignee: Dow Corning Corporation
    Inventors: Dale Earl Hauenstein, Arnold Wade Lomas, Kevin Edward Lupton, David Joseph Romenesko
  • Patent number: 5861450
    Abstract: An additive to improve the hydrophobicity of a thermoplastic resin wherein the additive is at least 0.3 parts by weight of a thermoplastic silicone blend, said thermoplastic silicone blend having:(A) an organosilicone resin of the empirical formula(R.sub.3 Sio.sub.1/2)a (R.sub.2 SiO.sub.2/2)b (RSiO.sub.3/2)c( SiO.sub.4/2) dwherein: a and d are positive numerical values and b and c are zero or positive numerical values with the provisos that a+b+c+d=1, 0.ltoreq.(b+c).ltoreq.0.2 and the ratio of a:(b+c+d) is between about 0.3 and 1.0; and R is a monovalent radical independently selected from the group consisting of hydrogen, hydroxyl, alkyl, alkenyl, alkoxy, oximo, aryl, epoxide, carboxyl, ether, polyether, amide and alkyl amino radicals, which R groups may be the same or different, with the proviso that at least sixty mole percent of said R radicals are methyl; and(B) a predominantly linear silicone fluid having the empirical formula(R'.sub.3 SiO.sub.1/2)x (R'.sub.2 SiO.sub.2/2)y (R'SiO.sub.
    Type: Grant
    Filed: August 28, 1996
    Date of Patent: January 19, 1999
    Assignee: Dow Corning Corporation
    Inventors: Wei Chen, Kevin Edward Lupton, David Joseph Romenesko, Randall Gene Schmidt, Hongxi Zhang
  • Patent number: 5844031
    Abstract: A method of dispersing silicone compositions in organic thermoplastic materials is disclosed. The novel compositions produced by the method of the invention have a fine and relatively uniform dispersion or organosilicone in an organic thermoplastic. An organosilicone resin (A) and a predominantly linear silicone fluid (B) are first blended to substantial homogeneity to form an organosilicone alloy therefrom. The organosilicone alloy exhibits thermoplastic behavior and has a temperature-dependent complex viscosity .eta.*.sub.Si (T) associated therewith. Likewise the organic thermoplastic materials have a temperature-dependent complex viscosity, .eta.*.sub.OTP (T), associated therewith. The organic thermoplastic and the organosilicone alloy are thereafter mixed at a predetermined mixing temperature, T.sub.m, and a predetermined shear strain rate. The organic thermoplastic material and the organosilicone alloy are both in a flowable state at T.sub.m. The value of T.sub.m is selected to be about .+-.30.degree. C.
    Type: Grant
    Filed: August 28, 1996
    Date of Patent: December 1, 1998
    Assignee: Dow Corning Corporation
    Inventors: Wei Chen, Hongxi Zhang, Kevin Edward Lupton, David Joseph Romenesko, Randall Gene Schmidt
  • Patent number: 5708098
    Abstract: Solventless, thermoplastic silicone pellets are prepared blending silicone resins (A) of the MQ-type and with predominantly linear silicone fluids (B), such as polydimethylsiloxane liquids and gums, to substantially homogeneity. The blends are heated to a predetermined compression-forming temperature, compression-formed to a densified mass and shaped into a pellet form. The composition of the pellets is balanced such that the pellets exhibit plastic flow at the predetermined compression-forming temperature and resist agglomeration at temperatures at or below a predetermined maximum storage temperature.
    Type: Grant
    Filed: August 28, 1996
    Date of Patent: January 13, 1998
    Assignee: Dow Corning Corporation
    Inventors: Leon Neal Cook, Richard Allen Hessick, Jr., Kevin Edward Lupton, David Joseph Romenesko, Randall Gene Schmidt, Hongxi Zhang