Patents by Inventor Kevin Formosa
Kevin Formosa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230110259Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.Type: ApplicationFiled: December 12, 2022Publication date: April 13, 2023Applicants: STMicroelectronics (MALTA) Ltd, STMicroelectronics S.r.l.Inventors: Kevin FORMOSA, Marco DEL SARTO
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Patent number: 11524892Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.Type: GrantFiled: March 30, 2020Date of Patent: December 13, 2022Assignees: STMicroelectronics (Malta) Ltd, STMicroelectronics S.r.l.Inventors: Kevin Formosa, Marco Del Sarto
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Patent number: 11352251Abstract: An electronic integrated circuit (IC) component is mounted to a substrate. A cap member is applied onto the substrate and covers the electronic IC component. The cap member includes an outer wall defining an opening and an inner wall surrounding the electronic IC component. The inner wall extends from a proximal end at the substrate towards a distal end facing the opening in the outer wall to provide a reception chamber for the electronic IC component and a peripheral chamber between the inner wall and the outer wall of the cap member. An encapsulant material is provided in the reception chamber to seal the electronic IC component without being present in the peripheral chamber.Type: GrantFiled: March 26, 2020Date of Patent: June 7, 2022Assignee: STMicroelectronics (Malta) LtdInventors: Kevin Formosa, Eftal Saribas
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Publication number: 20200307991Abstract: An electronic integrated circuit (IC) component is mounted to a substrate. A cap member is applied onto the substrate and covers the electronic IC component. The cap member includes an outer wall defining an opening and an inner wall surrounding the electronic IC component. The inner wall extends from a proximal end at the substrate towards a distal end facing the opening in the outer wall to provide a reception chamber for the electronic IC component and a peripheral chamber between the inner wall and the outer wall of the cap member. An encapsulant material is provided in the reception chamber to seal the electronic IC component without being present in the peripheral chamber.Type: ApplicationFiled: March 26, 2020Publication date: October 1, 2020Applicant: STMicroelectronics (Malta) LtdInventors: Kevin FORMOSA, Eftal SARIBAS
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Publication number: 20200307994Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.Type: ApplicationFiled: March 30, 2020Publication date: October 1, 2020Applicants: STMicroelectronics (Malta) Ltd, STMicroelectronics S.r.l.Inventors: Kevin FORMOSA, Marco DEL SARTO
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Patent number: 10329143Abstract: A packaged MEMS device, wherein at least two support structures are stacked on each other and are formed both by a support layer and a wall layer coupled to each other and delimiting a respective chamber. The chamber of the first support structure is upwardly delimited by the support layer of the second support structure. A first and a second dice are accommodated in a respective chamber, carried by the respective support layer of the first support structure. The support layer of the second support structure has a through hole allowing wire connections to directly couple the first and the second dice. A lid substrate, coupled to the second support structure, closes the chamber of the second support structure.Type: GrantFiled: December 21, 2015Date of Patent: June 25, 2019Assignee: STMicroelectronics (Malta) LtdInventor: Kevin Formosa
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Patent number: 10225635Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.Type: GrantFiled: April 29, 2016Date of Patent: March 5, 2019Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) LtdInventors: Roberto Brioschi, Alex Gritti, Kevin Formosa, Paul Anthony Barbara
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Publication number: 20170006368Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.Type: ApplicationFiled: April 29, 2016Publication date: January 5, 2017Inventors: Roberto BRIOSCHI, Alex GRITTI, Kevin FORMOSA, Paul Anthony BARBARA
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Publication number: 20160368098Abstract: An electronic component includes one or more circuits having a front surface and a light-permeable package material. A lid member is attached to a front surface of the circuit. The lid member is made, for example, of a light-blocking material such as a semiconductor or metal material. A laser marking is applied onto the lid member.Type: ApplicationFiled: April 21, 2016Publication date: December 22, 2016Applicant: STMicroelectronics (Malta) LtdInventors: Kenneth Fonk, Kevin Formosa
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Patent number: 9446943Abstract: A wafer-level packaging, comprising: a first semiconductor body integrating a MEMS structure; a second semiconductor body, including a surface electrical-contact region and an ASIC coupled to the MEMS structure and to said electrical-contact region; a first coating layer, made of resin, which englobes and protects the first body, the second body, and the electrical-contact region; at least one first conductive through via, which extends through the first coating layer in an area corresponding, and electrically coupled, to the first electrical-contact region; an electrical-contact pad, which extends over the first coating layer, electrically coupled to the first conductive through via; a third semiconductor body, integrating an electronic circuit, glued on the first coating layer; a second coating layer, made of resin, which englobes and protects the third body; at least one second conductive through via, which extends completely through the second coating layer in an area corresponding, and electrically couplType: GrantFiled: May 27, 2014Date of Patent: September 20, 2016Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) LtdInventors: Kevin Formosa, Luca Maggi
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Patent number: 9390988Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.Type: GrantFiled: September 28, 2012Date of Patent: July 12, 2016Assignee: STMicroelectronics (Malta) LtdInventors: Mark A. Azzopardi, Kevin Formosa, Ivan Ellul
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Publication number: 20160107884Abstract: A packaged MEMS device, wherein at least two support structures are stacked on each other and are formed both by a support layer and a wall layer coupled to each other and delimiting a respective chamber. The chamber of the first support structure is upwardly delimited by the support layer of the second support structure. A first and a second dice are accommodated in a respective chamber, carried by the respective support layer of the first support structure. The support layer of the second support structure has a through hole allowing wire connections to directly couple the first and the second dice. A lid substrate, coupled to the second support structure, closes the chamber of the second support structure.Type: ApplicationFiled: December 21, 2015Publication date: April 21, 2016Inventor: Kevin Formosa
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Patent number: 9257372Abstract: A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package.Type: GrantFiled: September 19, 2013Date of Patent: February 9, 2016Assignees: STMicroelectronics (Mala) Ltd, STMicroelectronics Pte LtdInventors: Roseanne Duca, Kim-Yong Goh, Xueren Zhang, Kevin Formosa
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Patent number: 9253579Abstract: A packaged MEMS device, wherein at least two support structures are stacked on each other and are formed both by a support layer and a wall layer coupled to each other and delimiting a respective chamber. The chamber of the first support structure is upwardly delimited by the support layer of the second support structure. A first and a second dice are accommodated in a respective chamber, carried by the respective support layer of the first support structure. The support layer of the second support structure has a through hole allowing wire connections to directly couple the first and the second dice. A lid substrate, coupled to the second support structure, closes the chamber of the second support structure.Type: GrantFiled: October 9, 2012Date of Patent: February 2, 2016Assignee: STMicroelectronics Ltd (Malta)Inventor: Kevin Formosa
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Publication number: 20140353775Abstract: A wafer-level packaging, comprising: a first semiconductor body integrating a MEMS structure; a second semiconductor body, including a surface electrical-contact region and an ASIC coupled to the MEMS structure and to said electrical-contact region; a first coating layer, made of resin, which englobes and protects the first body, the second body, and the electrical-contact region; at least one first conductive through via, which extends through the first coating layer in an area corresponding, and electrically coupled, to the first electrical-contact region; an electrical-contact pad, which extends over the first coating layer, electrically coupled to the first conductive through via; a third semiconductor body, integrating an electronic circuit, glued on the first coating layer; a second coating layer, made of resin, which englobes and protects the third body; at least one second conductive through via, which extends completely through the second coating layer in an area corresponding, and electrically couplType: ApplicationFiled: May 27, 2014Publication date: December 4, 2014Applicants: STMicroelectronics S.r.l., STMicroelectronics (Malta) LtdInventors: Kevin Formosa, Luca Maggi
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Patent number: 8837754Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.Type: GrantFiled: February 22, 2012Date of Patent: September 16, 2014Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Kevin Formosa, Mark Anthony Azzopardi, Mario Francesco Cortese, Mark Shaw, Alex Gritti, Luca Maggi, Filippo David
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Publication number: 20140091443Abstract: A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package.Type: ApplicationFiled: September 19, 2013Publication date: April 3, 2014Applicants: STMicroelectronics Pte Ltd, STMicroelectronics (Malta) LtdInventors: Roseanne Duca, Kim-Yong Goh, Xueren Zhang, Kevin Formosa
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Publication number: 20120153771Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.Type: ApplicationFiled: February 22, 2012Publication date: June 21, 2012Applicants: STMICROELECTRONICS (MALTA) LTD., STMICROELECTRONICS S.R.L.Inventors: Kevin Formosa, Mark Anthony Azzopardi, Mario Francesco Cortese, Mark Shaw, Alex Gritti, Luca Maggi, Filippo David
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Patent number: 7675170Abstract: A removable wafer expander for die bonding equipment for a singularized wafer supported by a flexible sticky substrate, the removable wafer expander provided with a first ring member to be coupled with a second ring member for remote expansion of the flexible sticky substrate therebetween before the mounting of the wafer expander onto the die bonding equipment.Type: GrantFiled: August 3, 2007Date of Patent: March 9, 2010Assignee: STMicroelectronics LtdInventor: Kevin Formosa
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Publication number: 20080032489Abstract: A removable wafer expander for die bonding equipment for a singularized wafer supported by a flexible sticky substrate, the removable wafer expander provided with a first ring member to be coupled with a second ring member for remote expansion of the flexible sticky substrate therebetween before the mounting of the wafer expander onto the die bonding equipment.Type: ApplicationFiled: August 3, 2007Publication date: February 7, 2008Applicant: STMICROELECTRONICS LTD.Inventor: Kevin Formosa