Abstract: The present invention generally provides method and apparatus for non-contact temperature measurement in a semiconductor processing chamber. Particularly, the present invention provides methods and apparatus for non-contact temperature measurement for temperature below 500° C. One embodiment of the present invention provides an apparatus for processing semiconductor substrates. The apparatus comprises a target component comprises a material with higher emissivity than the one or more substrates.

Abstract: A method for in-situ cleaning of a deposition system is disclosed. The method includes providing a deposition system with portions of the deposition system deposited with at least a group III element or a compound of a group III element. Halogen containing fluid is introduced into the deposition system. The halogen containing fluid is permitted to react with the group III element to form a halide. The halide in solid state is converted to a gaseous state. The halide in gaseous state is purged out of the deposition system.

Abstract: The present invention generally provides a method and apparatus for cleaning a showerhead of a deposition chamber, such as a metal organic chemical vapor deposition (MOCVD) chamber. In one embodiment, the showerhead is cleaned without exposing the chamber to the atmosphere outside of the chamber (i.e., in situ cleaning). In one embodiment, flow of liquid coolant through a cooling system that is in fluid communication with the showerhead is redirected to bypass the showerhead, and the liquid coolant is drained from the showerhead. In one embodiment, any remaining coolant is flushed from the showerhead via a pressurized gas source. In one embodiment, the showerhead is then heated to an appropriate cleaning temperature. In one embodiment, the flow of liquid coolant from the cooling system is then redirected to the showerhead and the system is adjusted for continued processing. Thus, the entire showerhead cleaning process is performed with minimal change to the flow of coolant through the cooling system.

Abstract: According to one aspect of the present disclosure, a circuit includes a semiconductor device including a plurality of logic blocks and a plurality of programmable interconnects. A delay detector generates a delay signal responsive to a measured delay of an output signal, wherein the output signal is from at least one of the plurality of logic blocks. A biasing circuit responsive to the delay signal to adjust subsequent measured delays toward a predetermined value.

Abstract: Embodiments of the present invention generally relate to methods and apparatus for removing unwanted deposition build-up from one more interior surfaces of a substrate processing chamber after a substrate is processed in a chamber to form, for example, Group III-V materials by metal-organic chemical vapor deposition (MOCVD) deposition processes and/or hydride vapor phase epitaxial (HVPE) deposition processes. In one embodiment, a method for removing unwanted deposition build-up from one or more interior surfaces of a substrate processing chamber is provided. The method comprises depositing one or more Group III containing layers over a substrate disposed in the substrate processing chamber, transferring the substrate out of the substrate processing chamber, and pulsing a halogen containing gas into the substrate processing chamber to remove at least a portion of the unwanted deposition build-up from one or more interior surfaces of the substrate processing chamber.

Abstract: According to one aspect of the present disclosure, a circuit includes a semiconductor device including a plurality of logic blocks and a plurality of programmable interconnects. A delay detector generates a delay signal responsive to a measured delay of an output signal, wherein the output signal is from at least one of the plurality of logic blocks. A biasing circuit responsive to the delay signal to adjust subsequent measured delays toward a predetermined value.

Abstract: A lock template includes an elongated body member that defines a substantially rectangular first opening having a first length and a first width and an elongated first member. The elongated first member is configured to be removably-inserted into first end recesses of the body such that the first member is located at least partially within the first opening. The first member, when inserted in the first end recesses of the body, defines a wall of a second opening having a length substantially equal to the first length and a width smaller than the first width. The second opening is configured to guide a cutting instrument to form a mortise for a lock component in a passageway component. When the first member is inserted into the first end recesses a longitudinal central axis of the first insert member is offset from a central axis between the first end recesses of the body.

Abstract: The present invention generally provides method and apparatus for non-contact temperature measurement in a semiconductor processing chamber. Particularly, the present invention provides methods and apparatus for non-contact temperature measurement for temperature below 500° C. One embodiment of the present invention provides an apparatus for processing semiconductor substrates. The apparatus comprises a target component comprises a material with higher emissivity than the one or more substrates.

Abstract: A lock template includes an elongated body member that defines a substantially rectangular first opening having a first length and a first width and an elongated first member. The elongated first member is configured to be removably-inserted into first end recesses of the body such that the first member is located at least partially within the first opening. The first member, when inserted in the first end recesses of the body, defines a wall of a second opening having a length substantially equal to the first length and a width smaller than the first width. The second opening is configured to guide a cutting instrument to form a mortise for a lock component in a passageway component. When the first member is inserted into the first end recesses a longitudinal central axis of the first insert member is offset from a central axis between the first end recesses of the body.

Abstract: A lottery game card for playing a Sudoku-themed game is disclosed. The lottery game card includes a plurality of squares arranged in rows and columns, each square having a symbol. Selected squares are covered with a removable material. The lottery game card also includes a plurality of prize indicators, each prize indicator being associated with a predefined pattern of squares. Upon removing of covered squares by a player, if symbols in the plurality of squares match a predefined pattern, the player wins a prize associated with the predefined pattern.

Abstract: A system and method for automatically mounting a pellicle assembly on a photomask are disclosed. The method includes loading a photomask into a mounting apparatus and loading a pellicle assembly into a back plate of the mounting apparatus opposite the photomask. The back plate includes at least one load cell that measures a force applied by the mounting apparatus to the photomask and the pellicle assembly. The measured force associated with the at least one load cell is received and the pellicle assembly is mounted on the photomask to create a photomask assembly if the measured force is greater than or approximately equal to a minimum force.

Abstract: An apparatus, program product and method backs up computer data by organizing update requests into groups. All update requests in one group complete concurrently before requests of a subsequent group complete.

Abstract: An apparatus and method provides the capability of mirroring storage from a primary system to a mirrored system in a way that uses parallelism in the mirrored system to maximize the efficiency of writing data to the mirrored storage for operations that do not conflict while serializing operations that do conflict. The mirroring of the present invention is “logical mirroring”, which does not require identical disk drives, and which supports mirroring between geographically remote locations to protect against catastrophic site failure. Parallelism is achieved in the mirrored system by dividing the virtual address space into multiple ranges, and by assigning a group of tasks to each range. When an operation is received on the mirrored system, the virtual address range that the operation affects is determined, and the operation is then delegated to the task group that corresponds to the affected virtual address range. By dividing the virtual address space into ranges, tasks in different ranges (i.e.

Abstract: An apparatus and method provides the capability of mirroring storage between geographically remote locations in an asynchronous manner that does not require all writes on primary storage to be performed in the same order on the mirrored storage. The mirroring of the present invention is “logical mirroring”, which does not require identical disk drives, and which supports mirroring between geographically remote locations to protect against catastrophic site failure. A sequence number is assigned to data written to primary storage before the data is transferred to the mirrored storage. The mirrored storage can write data asynchronously, which may result in some data being written before previous data on the mirrored storage. When a system failure occurs that requires use of the mirrored storage, the mirrored storage is first quiesced to allow all pending writes to occur.