Abstract: A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Abstract: A seeding implement is provided that includes a depth adjustment mechanism configured to facilitate rapid reconfiguration of a ground engaging tool for varying penetration depths. In an exemplary embodiment, the seeding implement includes a ground engaging tool and a packer arm pivotally coupled to a packer support structure. The seeding implement also includes a packer wheel rotatably coupled to the packer arm, and configured to rotate across a soil surface to limit a penetration depth of the ground engaging tool into the soil. The seeding implement further includes a depth adjustment assembly including a slot within the packer support structure, a corresponding slot within the packer arm, and a fastener disposed through the slots. In this configuration, the penetration depth of the ground engaging tool is varied by adjusting a position of the fastener within the slots.

Abstract: A seeding implement is provided that includes a depth adjustment mechanism configured to facilitate rapid reconfiguration of a ground engaging tool for varying penetration depths. In an exemplary embodiment, the seeding implement includes a ground engaging tool and a packer arm pivotally coupled to a packer support structure. The seeding implement also includes a packer wheel rotatably coupled to the packer arm, and configured to rotate across a soil surface to limit a penetration depth of the ground engaging tool into the soil. The seeding implement further includes a depth adjustment assembly including a slot within the packer support structure, a corresponding slot within the packer arm, and a fastener disposed through the slots. In this configuration, the penetration depth of the ground engaging tool is varied by adjusting a position of the fastener within the slots.

Abstract: A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract: A commodity tank for use with an air seeding implement includes a series of panels arranged to form an enclosure defining a volume configured to hold a supply of commodity. At least one or more of the panels has a warping-reducing bend formed therein. The commodity tank further has a series of tubular members with each tubular member located between adjacent and perpendicular panels to define a respective corner of the enclosure.

Abstract: A hopper of a commodity conveyor apparatus for use with an agricultural implement has a bin configured to hold a volume of a granular commodity. The bin is movable between a first position at which the bin can be loaded with the granular commodity and a second position at which residual granular commodity can be recovered from the bin. The hopper further has a fill opening formed in the bin and adapted for loading the granular commodity into the bin when the bin is in the first position. A discharge opening is configured to be flow-coupled to the commodity conveyor apparatus and a container is removably attached to the bin for recovering the residual granular commodity from the bin when the bin is in the second position.

Abstract: A mobile tool facility is provided having a container configured to be moved to a plurality of locations. A portal system is positioned in an interior of the container and spaced from a container end allowing access to the portal system. The portal system is operable to control access into and out of the container. A radio frequency shield wall is positioned in the interior of the container and spaced from the portal system allowing access between the portal system and the shield wall. The shield wall is configured to reduce an amount of electromagnetic energy entering the interior of the container. An auxiliary power unit associated with the container is operable to provide power to the portal system. A plurality of items stored in the interior of the container in a controlled space is available to be removed from the container through the portal system by an authorized individual.

Abstract: A seeding implement is provided that includes a depth adjustment mechanism configured to facilitate rapid reconfiguration of a ground engaging tool for varying penetration depths. In an exemplary embodiment, the seeding implement includes a ground engaging tool and a packer arm pivotally coupled to a packer support structure. The seeding implement also includes a packer wheel rotatably coupled to the packer arm, and configured to rotate across a soil surface to limit a penetration depth of the ground engaging tool into the soil. The seeding implement further includes a depth adjustment assembly including a slot within the packer support structure, a corresponding slot within the packer arm, and a fastener disposed through the slots. In this configuration, the penetration depth of the ground engaging tool is varied by adjusting a position of the fastener within the slots.

Abstract: A seeding implement is provided that includes a depth adjustment mechanism configured to facilitate rapid reconfiguration of a ground engaging tool for varying penetration depths. In an exemplary embodiment, the seeding implement includes a ground engaging tool and a packer arm pivotally coupled to a packer support structure. The seeding implement also includes a packer wheel rotatably coupled to the packer arm, and configured to rotate across a soil surface to limit a penetration depth of the ground engaging tool into the soil. The seeding implement further includes a depth adjustment assembly including a slot within the packer support structure, a corresponding slot within the packer arm, and a fastener disposed through the slots. In this configuration, the penetration depth of the ground engaging tool is varied by adjusting a position of the fastener within the slots.

Abstract: Provided herein is a method of inhibiting degradation of nucleic acids during a nucleic acid processing step selected from fragmentation and detection comprising contacting the nucleic acids with a solution comprising gallic acid, analogues, derivatives thereof or mixtures thereof, during the processing step, wherein the contacting inhibits degradation of the nucleic acids. Also provided herein is a method of inhibiting light-induced degradation of nucleic acids. Additionally, provided herein is a method of reducing or inhibiting nucleic acid damage during preparation of a nucleic acid sample comprising fragmenting the nucleic acid sequences in the sample in a solution comprising one of more compounds, the compounds inhibiting degradation of the nucleic acid sequences in the sample.

Abstract: A commodity tank for use with an air seeding implement includes a series of panels arranged to form an enclosure defining a volume configured to hold a supply of commodity. At least one or more of the panels has a warping-reducing bend formed therein. The commodity tank further has a series of tubular members with each tubular member located between adjacent and perpendicular panels to define a respective corner of the enclosure.

Abstract: A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes depositing a liquid based material onto a top surface of a rotatable plate. The top surface of the rotatable plate has at least one cavity formed thereon that defines the shape of a layer of the z-directed component. The rotatable plate is spun to level a top surface of the liquid based material in the at least one cavity. The liquid based material is cured to form the layer of the z-directed component. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed including a stack of component layers that includes the formed layer.

Abstract: A Z-directed component for mounting in a mounting hole in a printed circuit board according to one example embodiment includes a main body portion and a tapered end portion that facilitates insertion of the Z-directed component into the mounting hole in the printed circuit board. The tapered end portion is removably attached to the main body portion such that the tapered end portion may be removed after the Z-directed component is inserted into the mounting hole in the printed circuit board. A method for installing a Z-directed component having a removable tapered lead-in into the mounting hole according to one example embodiment includes inserting the Z-directed component into the mounting hole in the printed circuit board with the removable tapered lead-in leading the insertion and after the Z-directed component is inserted into the mounting hole, removing the removable lead-in from the rest of the Z-directed component.

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes forming the Z-directed component in a cavity formed by a constraining material that defines the outer shape of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

Abstract: A portable dispensing device is provided having a container configured to be moved to a plurality of locations. An access point at an opening of the container controls access into and out of the container. A scale is coupled to a bin within the container and is configured to measure a weight of the bin and contents of the bin. A computing device is in electrical communication with the access point and the scale and configured to allow or deny access to the container as well as receive the measured weight from the scale to determine a number of items in the bin. The computing device further associates an item removed from the bin with the individual or credits an item returned to the bin with the individual when the individual exits the container.

Abstract: A double door assembly having an active door and a passive door includes an astragal that is formed of a composite of aluminum and wood. The astragal is formed of an aluminum rail with a U-shaped cross section that receives a wooden insert. The astragal is mounted to a passive door such that the U-shaped cross section opens to the active door and the wooden insert presents a mounting surface for hardware.

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material.

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.

Abstract: A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes depositing a liquid based material onto a top surface of a rotatable plate. The top surface of the rotatable plate has at least one cavity formed thereon that defines the shape of a layer of the z-directed component. The rotatable plate is spun to level a top surface of the liquid based material in the at least one cavity. The liquid based material is cured to form the layer of the z-directed component. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed including a stack of component layers that includes the formed layer.

Abstract: A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.