Abstract: A serial data communication system and protocol for communicating data on a serial data bus in a vehicle. The serial data communication system includes a serial data bus connected to a plurality of electronic devices in a vehicle. Each of the electronic devices includes an encoder for encoding bits of information and a decoder for receiving data and decoding the received serial data. The present invention provides for a communication protocol for communicating data on the serial data bus including the steps of providing serial data to be transmitted onto the serial data bus in the vehicle. The serial data is encoded with a pulse width varying as a function of a time, and the time-based variable pulse width is assigned to groupings of at least two data bits to code each of the data bit groupings. A series of coded data bit groupings are transmitted onto the serial data bus in the vehicle, and the electronic devices may receive and decode the encoded data signals to decipher the data.

Abstract: A method by which a conventional circuit trace (14) is modified with a layer (16) of high-conductivity solder alloy to yield a high-current circuit trace (12) for high-current routing on a substrate (10). The method generally entails the use of a solder composition that contains a dispersion of metal particles (18) in a solder alloy (20). The metal particles (18) are selected on the basis of having a higher electrical conductivity than the solder alloy (20), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (20). The solder composition is deposited on a conductor (14), and then reflowed to form a conductive layer (16) on the conductor (14). The metal particles (18) remain as a discrete dispersion within the conductive layer (16) in order to suitably promote the conductivity of the layer (16).

Abstract: An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a bus wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the bus wires are laid, they will pass through the holes in the PCB and/or pass through the wire slots of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween.

Abstract: An improved interconnect apparatus for high power circuits that is low in cost and amenable for integration with low power circuits in a single electronic package. The interconnect apparatus includes serially connected surface mount bus bars bridging two or more metal pads or traces formed on a standard circuit board of the type used to package low power circuitry. The surface mount bus bars operate not only to conduct the higher currents, but also to draw heat out of the metal pads or intervening portions of the metal traces. This keeps the temperature within the capabilities of low power circuit board technology, and allows very narrow high power interconnects for reduced package size. Manufacturing cost advantages are achieved because the surface mount bus bars are assembled by automated pick-and-place equipment of the same type used for other surface mount components used in the package.

Abstract: An automotive circuit package combines electronic control functions and power function on a single circuit board substrate. Electronic components including signal level terminals are in one section of the substrate and an array of power terminals are in a second section of the substrate but sharing some common circuit paths carrying control signals. Supplemental conductors in the second section are selectively connected to power terminals to carry high current levels. Each terminal is a through access terminal for directly connecting conductors on the substrate, wiring harness connectors on one side of the substrate and fuses and relays on the other side of the substrate. In one embodiment the terminals have a male portion extending from one side of the substrate and a female portion on the other side. In another embodiment male and female portions are on the same side of the substrate and apertures in the substrate allow plugging into the female portions from the other side.

Abstract: In a preferred embodiment, an object orientation sensor device, including: a first LC tag disposed at a first selected location in the object; a driver/reader circuit disposed so as to detect the presence of the first LC tag when the object is in a first orientation and to not detect the presence of the first LC tag when the object is not in the first orientation; and the driver/reader circuit being arranged to energize the first LC tag with a magnetic field and to subsequently detect a first resonant frequency echo produced by the first LC tag when the magnetic field is removed.