Abstract: The invention provides a versatile technique for machining of nanometer-scale features using tightly-focused ultrashort laser pulses. By the invention, the size of features can be reduced far below the wavelength of light, thus enabling nanomachining of a wide range of materials. The features may be extremely small, of nanometer size, and are highly reproducible.

Abstract: Methods and compositions for detecting the assembly of complexes include providing a solution where a first portion is separated from a second portion via a submicrometer pore, submicrometer tube or channel, nanopore, or nanotube or channel. One or more submicrometer or nanometer sized object(s) is added to the first portion of the solution. Due to molecular interactions, these objects assemble to form complexes consisting of two or more submicrometer or nanometer sized objects. Passage of a complex from the first portion of the solution through the submicrometer pore, submicrometer tube or channel, nanopore, or nanotube or channel to the second portion of the solution is detected using resistive pulse sensing. This sensing methodology may comprise detecting formation of complexes in real-time and/or may comprise detecting preassembled complexes.

Abstract: The invention provides a versatile technique for machining of nanometer-scale features using tightly-focused ultrashort laser pulses. By the invention, the size of features can be reduced far below the wavelength of light, thus enabling nanomachining of a wide range of materials. The features may be extremely small, of nanometer size, and are highly reproducible.