Abstract: A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. The optical chip having a waveguide having an axis. A portion of the waveguide is removed to form the access point such that light exiting the planar optical waveguide is directed in a direction substantially different from the axis of the waveguide. An optical probe is placed along a propagation path of the exiting light to optically couple the optical probe and optical chip.

Abstract: A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. Inserting a probe at the access point to optically couple the optical probe and optical chip. The optical probe includes at least a first optical waveguide for changing the direction of input light at the probe to optically couple with the optical chip at the access point.

Abstract: An external gain system includes a gain source, a laser coupler, one or more mode converters, a high index contrast waveguide, and a filter structure fabricated on either high or low index contrast waveguides. The filter structure defines the external cavity with the front facet of the laser diode. An external cavity laser is further integrated with one or more functional blocks to perform a specific function. A multiplexer is integrated with the external cavity laser array, where the waveguide ends of the external cavity serve as an input to the multiplexer, to form an integrated WDM transmitter. The output of the transmitter, if fabricated on high index contrast waveguide, is then coupled to a low index waveguide or fiber matched waveguide by using a mode converter. The gain system can be configured to become a linear optical amplifier and can also be configured as a low cost wavelength converter.

Abstract: A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. Inserting a probe at the access point to optically couple the optical probe and optical chip. The optical probe includes at least a first optical waveguide for changing the direction of input light at the probe to optically couple with the optical chip at the access point.

Abstract: A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. The optical chip having a waveguide having an axis. A portion of the waveguide is removed to form the access point such that light exiting the planar optical waveguide is directed in a direction substantially different from the axis of the waveguide. An optical probe is placed along a propagation path of the exiting light to optically couple the optical probe and optical chip.