Abstract: A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

Abstract: A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate.

Abstract: A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a flex layer including a gate trace providing an electrical connection to a gate input connection of the power module, a first substrate, a second substrate including a source plane, the source plane including a step trench, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate trace, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery configured to supply the DC power to the inverter; and a motor configured to receive the AC power from the inverter.

Abstract: A power module includes: a fin housing including a fluid passage; a power switch having an exterior surface; and a fin system comprising a plurality of fins attached to a base plate, the plurality of fins extending from the base plate and away from the exterior surface of the power switch, the fin system being in thermal connection with the exterior surface of the power switch and disposed within the fluid passage.

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a bulk capacitor; one or more phase switches; and one or more controllers configured to control a gate voltage to the one or more phase switches to discharge the bulk capacitor, wherein the one or more controllers is configured to control the gate voltage based on one or more of a measured temperature of the one or more phase switches or an estimated temperature of the one or more phase switches.

Abstract: A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.

Abstract: A system includes an inverter including: a point-of-use controller for a power module, the point-of-use controller including: a positive voltage connection configured to receive a positive control voltage from a high-voltage controller; a command connection configured to receive a command from the high-voltage controller; a message connection configured to send and receive a message to and from the high-voltage controller; a negative voltage connection configured to receive a positive control voltage from the high-voltage controller; a north gate connection configured to output a north gate control signal to a north group of one or more switches; a south gate connection configured to output a south gate control signal to a south group of one or more switches; a north sense connection configured to connect to a first portion of a sensing trace; and a south sense connection configured to receive a second portion of the sensing trace.

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module including: a first substrate including a first conductive layer; a second substrate including a second conductive layer; a power switch between the first substrate and the second substrate; and a flex layer between the first substrate and the second substrate, the flex layer electrically connected to the power switch.

Abstract: A system comprises an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: an upper phase controller configured to store upper phase data; a lower phase controller configured to store lower phase data; and a data coherence interface providing a communication interface between the upper phase controller and the lower phase controller for data coherence between the stored upper phase data and the stored lower phase data.

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first power module, the first power module including: a first substrate including a first conductive layer; a second substrate including a second conductive layer; a power switch between the first conductive layer and the second conductive layer, the power switch including a gate connection, wherein the power switch is configured to selectively electrically connect the first conductive layer to the second conductive layer based on a signal to the gate connection; and a point-of-use controller between the first conductive layer and the second conductive layer, the point-of-use controller configured to provide the signal to the gate connection to control the power switch.

Abstract: A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a semiconductor die coupled to the inner surface of the first substrate; and a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate.

Abstract: A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a power switch including a semiconductor die, the power switch being coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the power switch being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate; a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate; and a flex circuit coupled to the power switch.

Abstract: A method for mounting a fin system in a power module includes: sintering a fin system to a first base substrate, the fin system comprising a plurality of fins attached to and extending away from a base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; and soldering a heat dissipation element to the second base substrate.

Abstract: A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

Abstract: A power module, includes: one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.

Abstract: A system comprises an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a galvanic isolator separating a high voltage area from a low voltage area; a low voltage phase controller in the low voltage area, the low voltage phase controller configured to receive a pulse width modulation (PWM) signal from an inverter controller and adjust the received PWM signal based on a feedback signal; and a high voltage phase controller in the high voltage area, the high voltage phase controller configured to receive the adjusted PWM signal from the low voltage phase controller, provide the adjusted PWM signal to a phase switch, and provide the feedback signal based on an on-time measurement of the phase switch.

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first power module including: a first connection; a second connection; a first power switch including a first gate terminal, the first power switch configured to control a first flow of current between the first connection and the second connection based on a first signal to the first gate terminal; and a first point-of-use controller configured to provide the first signal to the first gate terminal to control the first power switch.

Abstract: A method for phase-voltage based motor period measurement includes generating a commanded phase voltage and applying the commanded phase voltage to a first phase voltage input of an electric motor, a second phase voltage input of the electric motor, and a third phase voltage input of the electric motor, measuring a first period of a phase voltage associated with the first phase voltage input and the second phase voltage input and comparing the measured first period to a frequency of the commanded phase voltage, and, in response to a determination that the measured first period of the phase voltage associated with the first phase voltage input and the second phase voltage input is outside of a range of the frequency associated with the commanded phase voltage, identifying a fault associated with the first integrated circuit or signal path.

Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.

Abstract: A method for phase-voltage based motor period measurement includes generating a commanded phase voltage and applying the commanded phase voltage to a first phase voltage input of an electric motor, a second phase voltage input of the electric motor, and a third phase voltage input of the electric motor, measuring a first period of a phase voltage associated with the first phase voltage input and the second phase voltage input and comparing the measured first period to a frequency of the commanded phase voltage, and, in response to a determination that the measured first period of the phase voltage associated with the first phase voltage input and the second phase voltage input is outside of a range of the frequency associated with the commanded phase voltage, identifying a fault associated with the first integrated circuit or signal path.