Abstract: A system, methods, and apparatus for matching employers to employees are disclosed. In an example embodiment, preferences submitted by employers and employees are stored. The preferences may include number of open positions, industry, location, salary, work experience, education level and background information received from employers and employees. The employers may be stably matched to employees in a many to many relationship. The resulting matches may be stable such that (i) no employee would prefer to be unmatched than stay with the employer matched with the employee, (ii) no employer would prefer to be unmatched than stay with the employees matched with the employer, and (iii) no employee and employer that are not matched with each other would prefer to match with each other rather than remain matched with their current matches. The matches may be employer-optimized or employee-optimized.

Abstract: The present invention provides a double-sided memory module with improved memory device density and improved manufacturability, and with optional bus terminations mounted directly on the memory module for use with high speed, impedance-controlled memory buses. It also allows the same memory devices to be used on both sides of the card, instead of requiring memory devices with mirrored I/O connections on a second side as on prior art double-sided memory cards. The memory module may be formed on a conventional printed circuit card using cost-effective printed circuit board line widths and spaces with unpacked or packed memory chips attached directly to the memory module, while maintaining good signal integrity. Using memory modules with bus terminations mounted directly on the module improves the signal quality and integrity even further and therefore enhances system performance.

Abstract: A solder dispenser which includes a body portion having a sleeve thereon with a moveable shuttle extending through the sleeve. A solder holder bracket is retained on the moveable shuttle for retaining a spool of solder on the solder dispsenser. A solder gripper is carried on the body for gripping solder upon moving the shuttle to extend a length of solder from the solder spool. The solder gripper acts as a one-way cam which retains the solder as it is being extending from the spool but also allows solder to pass therethrough once it is extended from the spool. A trigger assembly is used to displace the shuttle and thereby extend a length of solder. The trigger assembly allows for dispensing a selected or desired length of solder from the spool.