Patents by Inventor Kevin M. Ripley

Kevin M. Ripley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9891002
    Abstract: A heat exchanger can include a stacked array of interconnected fluid transfer members. The stacked array of interconnected fluid transfer members can include a first fluid transfer member, a second fluid transfer member, a third fluid transfer member, and a fourth fluid transfer member. The first fluid transfer member can include a liquid passageway extending lengthwise though the first fluid transfer member and a set of helical fins extending outwardly from an outer surface of the first fluid transfer member and rotating along a length of the first fluid transfer member. The stacked array of interconnected fluid transfer members can form a jointless structure.
    Type: Grant
    Filed: August 22, 2015
    Date of Patent: February 13, 2018
    Inventors: Timothy A. Shedd, Brian B. Liu, Kevin M. Ripley, Tony P. Taylor
  • Publication number: 20160116218
    Abstract: A heat exchanger can include a first helical gas passageway extending from a first side of the heat exchanger to a second side of the heat exchanger. The first helical gas passageway can extend along and wrap around a first liquid passageway within the heat exchanger. A second helical gas passageway can extend from the first side of the heat exchanger to the second side of the heat exchanger. The second helical gas passageway can extend along and wrap around a second liquid passageway within the heat exchanger. Along a length of the first helical gas passageway, the first helical gas passageway can merge with the second helical gas passageway and then subsequently separate from the second helical gas passageway. The heat exchanger can be a liquid-to-gas counter-flow heat exchanger suitable for a wide variety of applications, including computer cooling.
    Type: Application
    Filed: August 22, 2015
    Publication date: April 28, 2016
    Inventors: Timothy A. Shedd, Brian B. Liu, Kevin M. Ripley, Tony P. Taylor
  • Publication number: 20160116222
    Abstract: A heat exchanger can include a stacked array of interconnected fluid transfer members. The stacked array of interconnected fluid transfer members can include a first fluid transfer member, a second fluid transfer member, a third fluid transfer member, and a fourth fluid transfer member. The first fluid transfer member can include a liquid passageway extending lengthwise though the first fluid transfer member and a set of helical fins extending outwardly from an outer surface of the first fluid transfer member and rotating along a length of the first fluid transfer member. The stacked array of interconnected fluid transfer members can form a jointless structure.
    Type: Application
    Filed: August 22, 2015
    Publication date: April 28, 2016
    Inventors: Timothy A. Shedd, Brian B. Liu, Kevin M. Ripley, Tony P. Taylor