Abstract: An apparatus and a method are disclosed for forming an electrical component construction, the method comprising: obtaining a chip webstock containing a plurality of integrated circuit chips; obtaining a label webstock having printed label graphics thereon; cutting the chip webstock into a plurality of chip sections, each of the chip sections including at least one integrated circuit chip; indexing the chip sections from a high density on the chip webstock to a lower density; attaching each of a plurality of the different chip sections on a different label on the label webstock; obtaining an electrical component webstock comprising electrical components on a web; and attaching each of a plurality of the electrical components relative to a different one of the integrated circuit chips on the label webstock to permit an electrical communication therebetween.

Abstract: A method and apparatus for bonding an RFID strap to a substrate, one embodiment of the method comprising: applying a bonding tape with an adhesive on at least one side to an RFID strap so that the RFID strap is mechanically bonded to the bonding tape to result in a laminated bonding tape and RFID strap, wherein the strap includes an electrical chip and strap leads, and wherein the strap does not include an antenna; cutting the laminated bonding tape and RFID strap into a piece so that the bonding tape extends beyond opposite ends of the RFID strap for the piece; and mechanically bonding the bonding tape of the piece to the substrate in an orientation so that the RFID strap leads on the piece electrically couple to an antenna.