Abstract: Systems, methods, and computer-readable media are disclosed for systems and methods for parallelized forensic analysis using cloud-based servers. Example methods may include generating a first request for one or more notifications in a notification queue, where the one or more notifications include a first notification indicative of a first data input at a datastore, determining a first data type of the first data input, and generating a second notification indicative of the first data type. Some example methods may include determining that a first software component is subscribed to notifications for the first data type, sending the second notification to the first software component, determining a first output of the first software component, where the first output comprises a set of extracted data from the first data input, and sending the set of extracted data to the datastore.

Abstract: A mirror component for receiving an actuator for adjusting a rear view position of a rear view mirror element in a rear view device includes at least one anti-back-out rib element for receiving an electrical connector of the actuator and an electrical mating connector to an electrical supply architecture being connected to the electrical connector, the anti-back-out rib element being an element enabling receiving either at least a first combination or a second combination of the electrical connector being connected to the electrical mating connector, the first and second combinations being differently shaped, and the anti-back-out rib element being adapted to prevent assembly of the actuator to the mirror component in case of the electrical connector being incorrectly connected to the electrical mating connector.

Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, an IC package support may include a layer of dielectric material; a conductive pad at least partially on a top surface of the layer of dielectric material; and a layer of material on side surfaces of the conductive pad, wherein the layer of material does not extend onto the top surface of the layer of dielectric material. Other embodiments are also disclosed.

Abstract: A cup liner for a cup of a spray gun includes a fluid reservoir portion that defines a reservoir and includes a divider portion dividing the reservoir into two or more compartments. Each compartment contains a fluid to be dispensed by the spray gun and keeps the fluids separated from fluids held by other compartments. In addition, a fitting for a spray gun includes two or more inlet interfaces and an outlet interface. Each inlet interface couples to a fluid source and the outlet couples to the spray gun such that the fitting provides fluid communication between each fluid source and the spray gun. This permits the spray gun to spray a mixture of the fluids.

Abstract: Techniques for fabricating a package substrate comprising a via, a conductive line, and a pad are described. The package substrate can be included in a semiconductor package. For one technique, a package substrate includes: a pad in a dielectric layer; a via; and a conductive line. The via and the conductive line can be part of a structure. Alternatively, the conductive line can be adjacent to the via. The dielectric layer can include a pocket above the pad. One or more portions of the via may be formed in the pocket above the pad. Zero or more portions of the via can be formed on the dielectric layer outside the pocket. In some scenarios, no pad is above the via. The package substrate provides several advantages. One exemplary advantage is that the package substrate can assist with increasing an input/output density per millimeter per layer (IO/mm/layer) of the package substrate.

Abstract: A dual axis linear motion system utilizing one or more printed circuit boards embedded within a stage wherein the system components, including the controller, drive, and controller, may be mounted to a printed circuit board (PCB), and the electrical communications between the system components and the power to the system components are supplied through traces or etchings on the printed circuit board, thereby omitting the need for additional power and communication cables.

Abstract: A linear motion system utilizing one or more printed circuit boards embedded within a stage wherein the system components, including the controller, drive, and controller, may be mounted to a printed circuit board (PCB), and the electrical communications between the system components and the power to the system components are supplied through traces or etchings on the printed circuit board, thereby omitting the need for additional power and communication cables.

Abstract: A dental implant including a base, a central shaft and a shock absorber spacing and allowing limited movement between the base and the central shaft. The shock absorber may also contain a plurality of flex struts. The dental implant may further include an index collar covering an upper portion in the base.

Abstract: A sanding tool is disclosed that can be used to remove a raised defect or imperfection from a painted surface. The sanding tool includes a base that defines an arcuate guide surface configured to be placed in contact with the base. In general, the base supports a sanding element for movement with respect to the base in a sanding motion. The guide surface maintains the sanding element at a desired position with respect to the painted surface while the sanding element moves in the sanding motion. An offset of the sanding element with respect to the guide surface can be selectively adjusted in certain embodiments. In some embodiments the guide surface is defined by first and second prongs spaced apart widthwise of the base, with the sanding element mounted between the prongs. A convex oscillating point sanding element is also disclosed.

Abstract: A load dissipating arthroplasty prosthesis comprising a shell, an articular device extending into the shell through a collar defined in the sell, a head and neck portion of the articular device extending from the collar, a shaft portion of the articular device extending into the shell, and a plurality of shock absorbing arcuate linkers spacing and allowing limited movement between the shell and the articular device.

Abstract: A linear motion system utilizing one or more printed circuit boards embedded within a stage wherein the system components, including the controller, drive, and controller, may be mounted to a printed circuit board (PCB), and the electrical communications between the system components and the power to the system components are supplied through traces or etchings on the printed circuit board, thereby omitting the need for additional power and communication cables.

Abstract: A dual axis linear motion system utilizing one or more printed circuit boards embedded within a stage wherein the system components, including the controller, drive, and controller, may be mounted to a printed circuit board (PCB), and the electrical communications between the system components and the power to the system components are supplied through traces or etchings on the printed circuit board, thereby omitting the need for additional power and communication cables.

Abstract: A thumb tab actuator for a firearm sling snap-hook is provided. The thumb tab actuator includes a body having a surface that engages a lever of a snap-hook that pivots in a first plane. The actuator body is adapted to be removably mounted to the lever, and the body includes a tab extending outwardly in a second plane transverse to the first plane when the body is mounted to the lever, such that the lever pivots in response to a force exerted on the tab. A user may couple the thumb tab to the snap-hook via a screw or other fastener. In some embodiments, the thumb tab includes a second tab for an ambidextrous configuration.

Abstract: A dental implant comprising a base, a central shaft and a shock absorber spacing and allowing limited movement between the base and the central shaft.

Abstract: A sling for coupling a firearm to a user is disclosed. The sling comprises a front sling section having a front end and a rear end, a front connector located at the front end for connecting the front sling section to the firearm, and a front buckle having a handle that adjusts the length of the sling. The handle includes a first member extending outwardly from the front sling section and a second member transverse to first member, such that, when the second member is pulled in a first direction, the length of front sling section lengthens, and when the second member is pulled in a second direction, the length of the front sling section shortens. The sling further comprises rear sling section coupled to the front sling section and having a front portion and a rear portion, a rear buckle detachably coupling the front portion to the rear portion, a rear connector for connecting the rear sling section to the firearm, and a middle connector.

Abstract: A process for managing satellite bandwidth available to a moving vessel includes configuring a satellite to associate the vessel with a group of multiple vessels; configuring the satellite to guarantee a committed information rate (CIR) bandwidth to the vessel and to associate a maximum information rate (MIR) with the vessel, and to combine the CIR of the vessel into a CIR bandwidth pool for the group of vessels, and to combine the MIR of the vessel into a MIR bandwidth pool for the group of vessels, and to provide the vessel with a priority burst rate up to the combined CIR bandwidth of the group of vessels, and to provide the vessel with a burst rate up to the combined MIR bandwidth of the group of vessels, conditional on availability of bandwidth beyond the combined CIR bandwidth of the group of vessels; and re-configuring the satellite to release the guarantee of CIR bandwidth for the vessel upon the vessel gaining access to a terrestrial network connection of higher speed than the satellite connection.

Abstract: A process for managing satellite bandwidth available to a moving vessel includes configuring a satellite to associate the vessel with a group of multiple vessels; configuring the satellite to guarantee a committed information rate (CIR) bandwidth to the vessel and to associate a maximum information rate (MIR) with the vessel, and to combine the CIR of the vessel into a CIR bandwidth pool for the group of vessels, and to combine the MIR of the vessel into a MIR bandwidth pool for the group of vessels, and to provide the vessel with a priority burst rate up to the combined CIR bandwidth of the group of vessels, and to provide the vessel with a burst rate up to the combined MIR bandwidth of the group of vessels, conditional on availability of bandwidth beyond the combined CIR bandwidth of the group of vessels; and re-configuring the satellite to release the guarantee of CIR bandwidth for the vessel upon the vessel gaining access to a terrestrial network connection of higher speed than the satellite connection.

Abstract: Semiconductor devices on a diffusion barrier coated metal substrates, and methods of making the same are disclosed. The semiconductor devices include a metal substrate, a diffusion barrier layer on the metal substrate, an insulator layer on the diffusion barrier layer, and a semiconductor layer on the insulator layer. The method includes forming a diffusion barrier layer on the metal substrate, forming an insulator layer on the diffusion barrier layer; and forming a semiconductor layer on the insulator layer. Such diffusion barrier coated substrates prevent diffusion of metal atoms from the metal substrate into a semiconductor device formed thereon.

Abstract: A dynamic fiber temperature sensing package is provided herein. The sensing package includes a support structure, a holder coupled to the support structure, a sheath coupled to the support structure via the holder, and a fiber optic temperature sensor positioned within the sheath. The holder includes a material having a first thermal conductivity and the sheath includes a material having a second thermal conductivity, wherein the second thermal conductivity is greater than the first thermal conductivity.