Patents by Inventor Kevin Michael Troy

Kevin Michael Troy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
    Publication number: 20220390970
    Abstract: A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be reconfigured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.
    Type: Application
    Filed: August 15, 2022
    Publication date: December 8, 2022
    Applicant: Octavo Systems LLC
    Inventors: Kevin Michael Troy, Peter Robert Linder
  • Component communications in system-in-package systems
    Patent number: 11416050
    Abstract: A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: August 16, 2022
    Assignee: OCTAVO SYSTEMS LLC
    Inventors: Kevin Michael Troy, Peter Robert Linder
  • Automatic test equipment method for testing system in a package devices
    Patent number: 11309056
    Abstract: Systems, methods, and computer program products directed to testing a System-in-a-Package (SIP) using an Automatic Test Equipment (ATE) machine. A functional representation of one or more tests to be performed in the SIP is loaded in a memory located on a load board, the load board located on the ATE machine. A test controller located on at least one of the SIP and the load board is caused to retrieve and store the one or more tests to be performed in the SIP. The test controller is instructed to conduct the one or more tests in the SIP.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: April 19, 2022
    Assignee: OCTAVO SYSTEMS LLC
    Inventor: Kevin Michael Troy
  • System-in-Package device ball map and layout optimization
    Patent number: 11032910
    Abstract: Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: June 8, 2021
    Assignee: OCTAVO SYSTEMS LLC
    Inventors: Erik James Welsh, Kevin Michael Troy
  • AUTOMATIC TEST EQUIPMENT METHOD FOR TESTING SYSTEM IN A PACKAGE DEVICES
    Publication number: 20200058364
    Abstract: Systems, methods, and computer program products directed to testing a System-in-a-Package (SIP) using an Automatic Test Equipment (ATE) machine. A functional representation of one or more tests to be performed in the SIP is loaded in a memory located on a load board, the load board located on the ATE machine. A test controller located on at least one of the SIP and the load board is caused to retrieve and store the one or more tests to be performed in the SIP. The test controller is instructed to conduct the one or more tests in the SIP.
    Type: Application
    Filed: January 31, 2018
    Publication date: February 20, 2020
    Applicant: Octavo Systems LLC
    Inventor: Kevin Michael TROY
  • COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
    Publication number: 20180321313
    Abstract: A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.
    Type: Application
    Filed: May 8, 2017
    Publication date: November 8, 2018
    Applicant: Octavo Systems LLC
    Inventors: Kevin Michael Troy, Peter Robert Linder, Masood Murtuza, Gene Alan Frantz
  • SYSTEM-IN-PACKAGE DEVICE BALL MAP AND LAYOUT OPTIMIZATION
    Publication number: 20180317323
    Abstract: Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 1, 2018
    Applicant: Octavo Systems LLC
    Inventors: Erik James Welsh, Kevin Michael Troy