Abstract: The present disclosure is directed to inhibitors of SHP2 and their use in the treatment of disease. Also disclosed are pharmaceutical compositions comprising the same.

Abstract: The present disclosure is directed to inhibitors of SHP2 and their use in the treatment of disease. Also disclosed are pharmaceutical compositions comprising the same.

Abstract: Methods for degassing and for removing impurities from molten metals are disclosed. These methods can include operating an ultrasonic device in a molten metal bath, and adding a purging gas into the molten metal bath in close proximity to the ultrasonic device.

Abstract: An apparatus may comprise a degassing system and a treatment station. The treatment station may comprise a shell, a refractory disposed in the shell, and insulation disposed between the shell and the refractory. The refractory may comprise a first plurality of slots, a second plurality of slots, and a trough. The first plurality of slots may be upstream from the degassing system and the second plurality of slots may be downstream from the degassing system. A first skim brick may be slideably disposed in a first one of the first plurality of slots and a second skim brick may be slideably disposed in a first one of the second plurality of slots. A first filter may be slideably disposed in a second one of the first plurality of slots and a second filter may be slideably disposed in a second one of the second plurality of slots.

Abstract: Methods for degassing and for removing impurities from molten metals are disclosed. These methods can include operating an ultrasonic device in a molten metal bath, and adding a purging gas into the molten metal bath in close proximity to the ultrasonic device.

Abstract: Methods for degassing and for removing impurities from molten metals are disclosed. These methods can include operating an ultrasonic device in a molten metal bath, and adding a purging gas into the molten metal bath in close proximity to the ultrasonic device.

Abstract: Methods for degassing and for removing impurities from molten metals are disclosed. These methods can include operating an ultrasonic device in a molten metal bath, and adding a purging gas into the molten metal bath through the tip of the ultrasonic device.

Abstract: Devices may be in contact with molten metals such as copper, for example. The devices may include, but are not limited to, a die used for producing articles made from the molten metal, a sensor for determining an amount of a dissolved gas in the molten metal, or an ultrasonic device for reducing gas content (e.g., hydrogen) in the molten metal. Niobium may be used as a protective barrier for the devices when they are exposed to the molten metals.

Abstract: A system for melting a substance may be provided. The system may include a crucible insulated with fused silica, a microwave generator configured to supply microwaves, and at least one burner probe extending into the crucible. The at least one burner probe may include a wave guide. The wave guide may be configured to receive microwaves from the microwave generator and transmit the microwaves. The at least one burner probe may further include an absorber. The absorber may have a geometry configured to cause a minimal amount of microwave energy to be reflected back into the wave guide. In addition, the absorber may include a one piece cast of silicon carbide configured to dissipate heat along an exterior of the absorber. The absorber may be further configured to receive the microwaves from the wave guide and convert energy from the microwaves into the heat.

Abstract: A system for melting a substance may be provided. The system may comprise a microwave generator, at least one wave guide, a melter assembly, and at least one thermal insulator. The at least one wave guide may connect the microwave generator to at least one power transfer element. The at least one wave guide may be configured to transfer microwave energy from the microwave generator to a refractory assembly. The melter assembly may comprise the refractory assembly and the at least one power transfer element connected to the refractory assembly. The refractory assembly may comprise at least one absorption element configured to transfer microwave energy, received from the at least one power transition element, into heat energy. The at least one thermal insulator may be configured to allow the microwaves to penetrate to the at least one absorption element.

Abstract: Devices may be in contact with molten metals such as copper, for example. The devices may include, but are not limited to, a die used for producing articles made from the molten metal, a sensor for determining an amount of a dissolved gas in the molten metal, or an ultrasonic device for reducing gas content (e.g., hydrogen) in the molten metal. Niobium may be used as a protective barrier for the devices when they are exposed to the molten metals.

Abstract: Devices may be in contact with molten metals such as copper, for example. The devices may include, but are not limited to, a die used for producing articles made from the molten metal, a sensor for determining an amount of a dissolved gas in the molten metal, or an ultrasonic device for reducing gas content (e.g., hydrogen) in the molten metal. Niobium may be used as a protective barrier for the devices when they are exposed to the molten metals.

Abstract: Methods for degassing and for removing impurities from molten metals are disclosed. These methods can include operating an ultrasonic device in a molten metal bath, and adding a purging gas into the molten metal bath through the tip of the ultrasonic device.

Abstract: Ultrasonic devices having an integrated gas delivery system are described, and these devices can be used to remove dissolved gasses and impurities from molten metals.

Abstract: Methods for degassing and for removing impurities from molten metals are disclosed. These methods can include operating an ultrasonic device in a molten metal bath, and adding a purging gas into the molten metal bath in close proximity to the ultrasonic device.

Abstract: Ultrasonic devices having an integrated purging gas delivery system are described, and such devices can be used to remove dissolved gasses and impurities from molten metals.

Abstract: A system for melting a substance may be provided. The system may comprise at least one burner probe. The at least one burner probe may comprise an absorber and a first wave guide configured to transmit microwaves. The absorber may be configured to receive the microwaves from the first wave guide and to convert energy from the microwaves into heat. The system may further comprise a second wave guide and a rotating wave guide. The rotating wave guide may be positioned between the first wave guide and the second wave guide. The rotating wave guide may comprise a plurality of sections configured to rotate about a central axis. The rotating wave guide may be configured to rotate approximately 90 degrees. For example, the rotating wave guide may comprise three sections wherein each one of the three sections may be configured to rotate approximately 30 degrees.

Abstract: Methods for degassing and for removing impurities from molten metals are disclosed. These methods can include operating an ultrasonic device in a molten metal bath, and adding a purging gas into the molten metal bath through the tip of the ultrasonic device.

Abstract: Methods for degassing and for removing impurities from molten metals are disclosed. These methods can include operating an ultrasonic device in a molten metal bath, and adding a purging gas into the molten metal bath in close proximity to the ultrasonic device.

Abstract: A system for melting a substance may be provided. The system may comprise at least one burner probe. The at least one burner probe may comprise an absorber and a first wave guide configured to transmit microwaves. The absorber may be configured to receive the microwaves from the first wave guide and to convert energy from the microwaves into heat. The system may further comprise a second wave guide and a rotating wave guide. The rotating wave guide may be positioned between the first wave guide and the second wave guide. The rotating wave guide may comprise a plurality of sections configured to rotate about a central axis. The rotating wave guide may be configured to rotate approximately 90 degrees. For example, the rotating wave guide may comprise three sections wherein each one of the three sections may be configured to rotate approximately 30 degrees.