Patents by Inventor Khai Tze Seow

Khai Tze Seow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR DETERMINING CONTACT HEIGHT OF A PACKAGED CHIP
    Publication number: 20230324312
    Abstract: A system and method that obtains contact heights of a packaged chip. In particular, the system includes a first light source for emitting direct light, a second light source for emitting structured light, two or more cameras pointed towards the packaged chip for capturing a first set of images of the packaged chip, and a second set of images of the packaged chip, and at least one processor that processes the first set of images and the second set of images captured by the cameras to determine contact heights of the packaged chip. The cameras capture the first set of images when the first light source emits direct light towards the packaged chip, and capture the second set of images when the second light source emits structured light towards the packaged chip.
    Type: Application
    Filed: October 3, 2022
    Publication date: October 12, 2023
    Applicant: Vitrox Technologies Sdn. Bhd.
    Inventors: Heng Juan Tan, Ting Lik Wong, Chee Kit Loh, Kek Keong Kim, Khai Tze Seow, Yi Ting San