Abstract: The simulation system for predicting heating and cooling loads of a building comprises the collection unit collecting measurement data of a target building from a BEMS, the identification unit identifying indoor and outdoor temperature, humidity, and insolation measured in the building in real time based on RTS method, the correlation derivation unit deriving a correlation between energy usage based on the BEMS measurement data collected by the collection unit and the cooling and heating loads according to indoor and outdoor temperature, humidity, and insolation identified by the identification unit, the simulation unit predicting a change in cooling and heating loads according to a change in at least one of pieces of measurement data based on the correlation derived from the correlation derivation unit to perform a simulation, and the information provision unit providing a simulation result from the simulation unit in a visible form to a user terminal.

Abstract: The present specification relates to a conductive structure body, a method for manufacturing the same, and an electrode and an electronic device including the conductive structure body.

Abstract: A battery management system according to an exemplary embodiment of the present invention includes: a current measuring unit for sampling a charge current and a discharge current of a battery; a charge and discharge amount calculator for calculating a charge and discharge amount corresponding to a difference between the sampled charge current and the sampled discharge current; a polarization voltage calculator for calculating a polarization voltage corresponding to the charge and discharge amount and a temperature of the battery; and a pulse generator for applying a polarization voltage reset pulse for the battery to remove the polarization voltage.

Abstract: The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

Abstract: Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.

Abstract: A battery management system according to an exemplary embodiment of the present invention includes: a current measuring unit for sampling a charge current and a discharge current of a battery; a charge and discharge amount calculator for calculating a charge and discharge amount corresponding to a difference between the sampled charge current and the sampled discharge current; a polarization voltage calculator for calculating a polarization voltage corresponding to the charge and discharge amount and a temperature of the battery; and a pulse generator for applying a polarization voltage reset pulse for the battery to remove the polarization voltage.

Abstract: Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.

Abstract: The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

Abstract: Disclosed are a light emitting module and a method of manufacturing the light emitting module.

Abstract: Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided.

Abstract: Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, including: (A) preparing an aluminum substrate; (B) patterning and etching an etching resist on the aluminum substrate; (C) forming an insulating layer by performing an anodizing treatment on the patterned aluminum substrate; and (D) forming a metal wiring layer by removing the etching resist. The aluminum wiring and the insulating layer are simultaneously formed on the surface of the aluminum patterned by etching through an anodizing method, thereby simplifying the manufacturing process of the substrate and improving adhesion between the metal wiring layer and the insulating layer. In addition, the thickness of the insulating layer and the thickness of the metal wiring layer can be controlled by controlling the anodizing treatment time, thereby providing a method for manufacturing a printed circuit board that can be manufactured to fit for use purpose.

Abstract: A multilayered wiring substrate and a manufacturing method thereof are disclosed.