Patents by Inventor Ki-Hoon Jang

Ki-Hoon Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120061557
    Abstract: Disclosed herein is a laser navigation module. The laser navigation system includes a light source, one or more illumination devices, and a re-reflecting layer. The light source emits laser light. The housing is configured such that a window for allowing the laser light emitted by the light source to pass therethrough, reflecting the laser light, and blocking entry of visible light is mounted and such that a transparent or translucent portion for diffusing internally diffused light to an outside is formed. The illumination devices are mounted inside the housing. The light diffusion member transfers light emitted by the illumination devices to the housing, and includes a re-reflecting layer partially formed on the side of the light diffusion member opposite the illumination devices.
    Type: Application
    Filed: November 26, 2010
    Publication date: March 15, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Ki Hoon Jang
  • Publication number: 20060189152
    Abstract: In a slurry composition preventing damage to an insulation layer, and uniformly polishing a metal layer, the slurry composition includes an acidic aqueous solution having a first pH and an anionic surfactant having a second pH lower than or equal to the first pH. Irregular polishing of the metal layer relative to a pattern density may be prevented and a contact having a uniform thickness may be formed using the slurry composition.
    Type: Application
    Filed: December 29, 2005
    Publication date: August 24, 2006
    Inventors: Ki-Hoon Jang, Yong-Sun Ko, Kyung-Hyun Kim
  • Publication number: 20060189126
    Abstract: A method of forming an epitaxial contact plug in a semiconductor device comprises forming an insulating interlayer on a semiconductor substrate, forming a mushroom-shaped epitaxial plug in an opening of the insulating interlayer, forming a buffer layer on the epitaxial plug and the insulating interlayer, and planarizing epitaxial plug and the insulating interlayer using a chemical mechanical polishing (CMP) process.
    Type: Application
    Filed: November 9, 2005
    Publication date: August 24, 2006
    Inventors: Ki-Hoon Jang, Yong-Sun Ko, Kyung-Hyun Kim