Patents by Inventor Ki Hoon Son

Ki Hoon Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170304
    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes treating modules having an opening for taking in and taking out a substrate and which are stacked on each other; and an air flow generating member for generating a downward airflow at each treating module, and wherein the air flow generating member includes: a pan unit configured to supply an air; a spray unit configured to be provided above the treating module and which sprays an air supplied from the pan unit; and an exhaust unit configured to exhaust an air sprayed by the spray unit to outside of the treating module.
    Type: Application
    Filed: November 21, 2023
    Publication date: May 23, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Ho Jong HWANG, Hyun Goo PARK, Hyo Won YANG, Ki-Moon KANG, Sang Min LEE, Se Hoon OH, Won Sik SON
  • Publication number: 20240066657
    Abstract: Provided are a control method, a control apparatus, a training method, and a training apparatus based on thickness estimation of a wafer substrate. The training method includes generating a training spectrum signal according to a thickness of a wafer substrate using an optical model, generating a training spectrum signal having a noise by applying a noise based on a noise parameter to the training spectrum signal, calculating a similarity between the training spectrum signal having the noise and an actually measured spectrum signal, and when the similarity satisfies a set condition, training a noise reduction model using the training spectrum signal having the noise.
    Type: Application
    Filed: April 28, 2023
    Publication date: February 29, 2024
    Applicant: KCTECH CO., LTD.
    Inventors: Ji Hoon SON, Jeong Heon HAN, Ki Hyuk YANG
  • Publication number: 20240005062
    Abstract: A method of providing design feedback comprises the steps of: storing design behavior information of a user for a target design; and comparing current design behavior information with previous design behavior information to provide the user with feedback on the current design behavior information, wherein the design behavior information includes at least one of a sketch drawing generated by a design sketch, a design reference search range, and a design reference identified by the user.
    Type: Application
    Filed: September 18, 2023
    Publication date: January 4, 2024
    Inventors: Kyung Hoon HYUN, Ki Hoon SON
  • Patent number: 10654424
    Abstract: Disclosed herein is a composite panel for sound absorption that may absorb and block noise. The composite panel may include: a first perforated panel comprising first embosses and first perforation groups formed in a predetermined pattern, wherein the first embosses are formed by forming a plurality of cells and the first perforation groups are formed by collecting a plurality of first perforated holes; an embossed panel comprising second embosses formed by forming the plurality of cells and coupled to the first perforated panel wherein the embossed panel is laminated with the first perforated panel; and a sound absorbing and insulating material inserted between the first perforated panel and the embossed panel.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: May 19, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Hantec Technology Co., Ltd.
    Inventors: Jae Gi Sim, Jung Hyeok Lim, Sung Il Choi, Ki Hoon Son
  • Publication number: 20190118733
    Abstract: Disclosed herein is a composite panel for sound absorption that may absorb and block noise. The composite panel may include: a first perforated panel comprising first embosses and first perforation groups formed in a predetermined pattern, wherein the first embosses are formed by forming a plurality of cells and the first perforation groups are formed by collecting a plurality of first perforated holes; an embossed panel comprising second embosses formed by forming the plurality of cells and coupled to the first perforated panel wherein the embossed panel is laminated with the first perforated panel; and a sound absorbing and insulating material inserted between the first perforated panel and the embossed panel.
    Type: Application
    Filed: December 13, 2017
    Publication date: April 25, 2019
    Inventors: Jae Gi Sim, Jung Hyeok Lim, Sung Il Choi, Ki Hoon Son