Patents by Inventor Ki Hwa Jung

Ki Hwa Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing compositions and methods of manufacturing semiconductor devices using the same
    Patent number: 10435587
    Abstract: A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: October 8, 2019
    Assignees: Samsung Electronics Co., Ltd., K.C. Tech Co., Ltd.
    Inventors: Seung-Ho Park, Ki-Hwa Jung, Sang-Kyun Kim, Jun-Ha Hwang, Chang-Gil Kwon, Seung-Yeop Baek, Jae-Woo Lee, Ji-Sung Lee, Jae-Kwang Choi, Jin-Myung Hwang
  • Method for preparing slurry composition and slurry composition prepared thereby
    Patent number: 10428240
    Abstract: The present invention relates to a method for preparing a slurry composition and a slurry composition prepared thereby, and has advantages of reducing scratches and residual particles, which are considered to be one of the biggest factors contributing to the decline in yield due to macroparticles and aggregated particles, while maintaining a high polishing rate, in a semiconductor CMP process. Furthermore, the present invention can achieve excellent results in the application to various patterns required in the ultra-large scale integration semiconductor process, the wafer non-uniformity (WIWNU) exhibiting a polishing rate, polishing selectivity, and polishing uniformity, which meet the needs, and the micro-scratch minimization.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: October 1, 2019
    Assignee: KCTECH CO., LTD.
    Inventors: Jang Kuk Kwon, Chan Un Jeon, Ki Hwa Jung, Jung Yoon Kim, Nak Hyun Choi, Seong Pyo Lee, Bo Hyeok Choi
  • METHOD FOR PREPARING SLURRY COMPOSITION AND SLURRY COMPOSITION PREPARED THEREBY
    Publication number: 20170051180
    Abstract: The present invention relates to a method for preparing a slurry composition and a slurry composition prepared thereby, and has advantages of reducing scratches and residual particles, which are considered to be one of the biggest factors contributing to the decline in yield due to macroparticles and aggregated particles, while maintaining a high polishing rate, in a semiconductor CMP process. Furthermore, the present invention can achieve excellent results in the application to various patterns required in the ultra-large scale integration semiconductor process, the wafer non-uniformity (WIWNU) exhibiting a polishing rate, polishing selectivity, and polishing uniformity, which meet the needs, and the micro-scratch minimization.
    Type: Application
    Filed: January 23, 2015
    Publication date: February 23, 2017
    Applicant: K.C. Tech Co., Ltd.
    Inventors: Jang Kuk KWON, Chan Un JEON, Ki Hwa JUNG, Jung Yoon KIM, Nak Hyun CHOI, Seong Pyo LEE, Bo Hyeok CHOI
  • POLISHING COMPOSITIONS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME
    Publication number: 20170029664
    Abstract: A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.
    Type: Application
    Filed: July 20, 2016
    Publication date: February 2, 2017
    Applicant: K.C. Tech Co., Ltd.
    Inventors: Seung-Ho PARK, Ki-Hwa JUNG, Sang-Kyun KIM, Jun-Ha HWANG, Chang-Gil KWON, Seung-Yeop BAEK, Jae-Woo LEE, Ji-Sung LEE, Jae-Kwang CHOI, Jin-Myung HWANG
  • 2-hydroxypropionic acid derivative and its manufacturing method
    Patent number: 6030993
    Abstract: This invention relates to a novel 2-hydroxypropionic acid derivative and its manufacturing method. Based on its mechanism to inhibit the CPT I, 2-hydroxypropionic acid derivative of this invention has blood glucose lowering effects so that the derivative may be effectively used as an antidiabetic agent having remarkable antidiabetic activity and fewer side effects.
    Type: Grant
    Filed: May 4, 1999
    Date of Patent: February 29, 2000
    Assignees: Sang Sup JEW, Kwang Ho KO, Bak Kwang KIM
    Inventors: Sang Sup Jew, Suk Ku Kang, Deuk Joon Kim, Won Ki Kim, Hwa Jung Kim, Chang Kiu Moon, Jeong Hill Park, Young Ger Suh, Bong Jin Lee, Jee Woo Lee, Ki Hwa Jung, Moon Woo Chun, Hoon Huh, Eung Seok Lee, Hyung Ook Kim, Eun Kyung Kim, Sung Jin Kim, Jae Hoon Cheong, Kwang Ho Ko, Bak Kwang Kim
  • Oxirane carboxylic acid derivative and its manufacturing method
    Patent number: 6013666
    Abstract: This invention relates to a novel oxirane carboxylic acid derivative and thereof manufacturing method. Based on thereof mechanism to inhibit the CPT I, oxirane carboxylic acid derivative of this invention has blood glucose lowering effects so that the derivative may be effectively used as an antidiabetic agent having remarkable antidiabetic activity and less side effects.
    Type: Grant
    Filed: May 11, 1999
    Date of Patent: January 11, 2000
    Assignees: Sang Sup Jew, Kang Ho Kang, Bak Kwang Kim
    Inventors: Sang Sup Jew, Suk Ku Kang, Deuk Joon Kim, Won Ki Kim, Hwa Jung Kim, Chang Kiu Moon, Jeong Hill Park, Young Ger Suh, Bong Jin Lee, Jee Woo Lee, Ki Hwa Jung, Moon Woo Chun, Hoon Huh, Eung Seok Lee, Hyung Ook Kim, Eun Kyung Kim, Sung Jin Kim, Jae Hoon Cheong, Kwang Ho Ko, Bak Kwang Kim