Abstract: Disclosed herein is an inspection robot system for the customs inspection of container-loaded cargo. The inspection robot system includes: an attachment-type mobile robot configured to drive in the state of being attached to the top surface of a container; and a flexible robot system configured to interface with the attachment-type mobile robot, to selectively accommodate and extend a flexible robot having multiple degrees of freedom, and to perform inspection on cargo.

Abstract: Disclosed is an integrated thermal management system for a vehicle including a refrigerant flow line extending to allow a refrigerant discharged from a compressor to flow in the order of an indoor condenser, an external condenser, and an evaporator and to flow back to the compressor, a refrigerant chiller line branching from the refrigerant flow line at each of the points downstream of the compressor, the indoor condenser, or the external condenser, the refrigerant chiller line joining the refrigerant flow line at a point upstream of the compressor after the refrigerant passes through a battery chiller and an electric chiller or bypasses the same, a battery cooling line extending to allow a coolant to circulate while passing through a battery radiator or the battery chiller, and an electric cooling line extending to allow a coolant to circulate while passing through an electric radiator or the electric chiller.

Abstract: An embodiment coolant management system for a mobility vehicle includes an inlet line and an outlet line configured to be connected to an external thermal management station and configured to selectively supply a cooling or heating coolant, a refrigerant circuit that circulates a refrigerant therethrough, the refrigerant circuit including a compressor, a condenser, an expander, and an evaporator, a first coolant line that circulates a coolant therethrough, wherein a battery and a first heat exchanger that exchanges heat with the evaporator of the refrigerant circuit are provided on the first coolant line, a second coolant line configured to circulate the coolant therethrough, wherein a second heat exchanger that exchanges heat with the condenser of the refrigerant circuit is provided on the second coolant line, and a controller that communicates with the external thermal management station and control respective valves to manage a temperature of the coolant.

Abstract: An integrated thermal management system for a vehicle may make refrigerant-related components compact by modularizing the refrigerant-related components.

Abstract: Provided are a vehicle sensor cleaning apparatus and a control method thereof. The vehicle sensor cleaning apparatus includes a liquid sprayer configured to spray washer fluid on at least one sensor arranged in a vehicle, an air sprayer configured to spray air on the at least one sensor, a liquid controller configured to control washer fluid spraying of the liquid sprayer, and an air controller configured to control air spraying of the air sprayer.

Abstract: An airfoil cooling structure, an airfoil having the airfoil cooling structure, and a turbine blade/vane element including the airfoil are disclosed. The airfoil cooling structure includes a cooling path formed inside the airfoil and having a first surface and a second surface opposite to the first surface, and an additive manufactured (AM) feature disposed in the cooling path, manufactured by additive manufacturing, and including a plurality of column parts intersecting with each other so as to abut against the first surface and the second surface.

Abstract: An airfoil cooling structure, an airfoil having the airfoil cooling structure, and a turbine blade/vane element including the airfoil are disclosed. The airfoil cooling structure includes a cooling path formed inside the airfoil and having a first surface and a second surface opposite to the first surface, and an additive manufactured (AM) feature disposed in the cooling path, manufactured by additive manufacturing, and including a plurality of column parts intersecting with each other so as to abut against the first surface and the second surface.

Abstract: Disclosed are a spinning dope for an aramid and carbon-nanotube composite fiber and a method of manufacturing an aramid and carbon-nanotube composite fiber using the same.

Abstract: An embodiment is a thermal management system for a vehicle, the thermal management system including a main refrigerant line in which a compressor, an indoor condenser, a first expansion valve, an outdoor condenser, a second expansion valve, and an indoor evaporator are sequentially provided, a battery cooling water line in which a battery, the chiller for a battery, and a water pump for a battery are sequentially provided, a refrigerant heater disposed between the compressor and the indoor condenser on the main refrigerant line, and a controller configured to control operations of the compressor and the refrigerant heater, control opening and closing of the first expansion valve and the second expansion valve, control operations of the water pump for an electric component and the water pump for a battery, and control flow paths of the refrigerant, the cooling water for an electric component, and the cooling water for a battery.

Abstract: A cleaning apparatus including a vacuum cleaner and a docking station is provided. The cleaning apparatus includes a vacuum cleaner including a dust collecting chamber in which foreign substances are collected, and a docking station configured to be connected to the dust collecting chamber to remove the foreign substances collected in the dust collecting chamber. The dust collecting chamber is configured to collect foreign substances through centrifugation, and configured to be docked to the docking station, and the docking station includes a suction device configured to suction the foreign substances and air in the dust collecting chamber docked to the docking station.

Abstract: A battery pack is advantageous for effective control and maintenance of thermal events. A battery pack according to one aspect of the present disclosure may include a battery module having one or more battery cells; a fire extinguishing tank holding a fire extinguishing liquid, disposed on top of the battery module and having a through hole formed therein; and a cover member installed in the through hole of the fire extinguishing tank and configured to open or close the through hole according to a change in internal pressure of the fire extinguishing tank.

Abstract: A semiconductor package includes a connection structure including a redistribution layer, a plurality of under bump metal layers electrically connected to the redistribution layer, a passivation layer which overlaps at least portions of side faces of the plurality of under bump metal layers, and includes a first trench disposed between under bump metal layers adjacent to each other, a surface mounting element which is on the under bump metal layers adjacent to each other, connected to the redistribution layer, and overlaps the first trench, and an underfill material layer that is between a portion of the passivation layer and the surface mounting element, and is in the first trench. The first trench extends in a first direction and includes a first sub-trench having a first width in a second direction, and a second sub-trench having a second width different from the first width in the second direction.

Abstract: A fan-out semiconductor package including a first redistribution layer; a first semiconductor chip on the first redistribution layer; an interconnector on the first redistribution layer and spaced apart from the first semiconductor chip; a molded layer covering the interconnector and side surfaces of the first semiconductor chip; and a second redistribution layer on the molded layer, wherein the interconnector includes a metal ball and is electrically connected to the first redistribution layer, the second redistribution layer includes a first line wiring, and a first via electrically connected to the first line wiring, the first via is connected to the interconnector, and a part of the first via is in the molded layer.

Abstract: A fan-out semiconductor package including a first redistribution layer; a first semiconductor chip on the first redistribution layer; an interconnector on the first redistribution layer and spaced apart from the first semiconductor chip; a molded layer covering the interconnector and side surfaces of the first semiconductor chip; and a second redistribution layer on the molded layer, wherein the interconnector includes a metal ball and is electrically connected to the first redistribution layer, the second redistribution layer includes a first line wiring, and a first via electrically connected to the first line wiring, the first via is connected to the interconnector, and a part of the first via is in the molded layer.

Abstract: A blood testing apparatus includes an analyzer configured to analyze blood components of an animal that are included in a test medium; an output device configured to display analysis results of the blood components; and a controller configured to determine a species of the animal based on at least one from among types of the blood components and the analysis results of the blood components and control the output device to display the determined species of the animal.

Abstract: A semiconductor package includes a connection structure including a redistribution layer, a plurality of under bump metal layers electrically connected to the redistribution layer, a passivation layer which overlaps at least portions of side faces of the plurality of under bump metal layers, and includes a first trench disposed between under bump metal layers adjacent to each other, a surface mounting element which is on the under bump metal layers adjacent to each other, connected to the redistribution layer, and overlaps the first trench, and an underfill material layer that is between a portion of the passivation layer and the surface mounting element, and is in the first trench. The first trench extends in a first direction and includes a first sub-trench having a first width in a second direction, and a second sub-trench having a second width different from the first width in the second direction.

Abstract: A semiconductor package mounted board includes a printed circuit board on which a plurality of first pads and a plurality of second pads are disposed on one surface, and a semiconductor package disposed on the one surface of the printed circuit board and including a plurality of third pads and a plurality of fourth pads. A plurality of first electrical connection structures electrically connect the plurality of first pads and the plurality of third pads, and one or more second electrical connection structures electrically connect the plurality of second pads and the plurality of fourth pads. The plurality of first pads are disposed to correspond to and overlap/align with the plurality of third pads from each other, and the plurality of second pads are disposed to be staggered and offset with respect to the plurality of fourth pads.

Abstract: A semiconductor package includes: a connection member having first and second surfaces opposing each other and including a redistribution layer; a support member disposed on the first surface of the connection member, including a cavity, and having an inner sidewall surrounding the cavity of which an upper region is chamfered; a semiconductor chip disposed on the connection member in the cavity and having connection pads electrically connected to the redistribution layer; at least one electronic component disposed between the semiconductor chip and the inner sidewall and having connection terminals electrically connected to the redistribution layer; and an encapsulant encapsulating the semiconductor chip and the at least one electronic component disposed in the cavity.

Abstract: A semiconductor package mounted board includes a printed circuit board on which a plurality of first pads and a plurality of second pads are disposed on one surface, and a semiconductor package disposed on the one surface of the printed circuit board and including a plurality of third pads and a plurality of fourth pads. A plurality of first electrical connection structures electrically connect the plurality of first pads and the plurality of third pads, and one or more second electrical connection structures electrically connect the plurality of second pads and the plurality of fourth pads. The plurality of first pads are disposed to correspond to and overlap/align with the plurality of third pads from each other, and the plurality of second pads are disposed to be staggered and offset with respect to the plurality of fourth pads.

Abstract: A blood testing apparatus includes an analyzer configured to analyze blood components of an animal that are included in a test medium; an output device configured to display analysis results of the blood components; and a controller configured to determine a species of the animal based on at least one from among types of the blood components and the analysis results of the blood components and control the output device to display the determined species of the animal.