Abstract: An imprinting apparatus includes a first frame, a pressure roller rotatably supported on a first end of the first frame, a second frame including a support portion coupled to a second end of the first frame, and at least one guide portion coupled to the support portion to be laterally movable, and at least one load roller supported by the at least one guide portion, the at least one load roller being movable in a vertical direction while being rotatable and contacting a surface of the pressure roller on an upper portion of the pressure roller according to a lateral movement of the guide portion, the at least one load roller to press the pressure roller by force exerted by a load of the at least one load roller.

Abstract: A film frame, a system for manufacturing a display substrate, and a method of manufacturing a display substrate, the film frame including a pair of frame edges extending lengthwise in a first direction and arranged opposite to each other; a fixed end clamp connected to the pair of frame edges and extending lengthwise in a second direction perpendicular to the first direction; and a free end clamp between the pair of frame edges, the free end clamp extending lengthwise in the second direction and configured to be detachably coupled with the pair of frame edges, wherein the fixed end clamp includes a first magnetic fixer extending lengthwise in the second direction and a second magnetic fixer on the first magnetic fixer, and the free end clamp includes a third magnetic fixer extending lengthwise in the second direction and a fourth magnetic fixer on the third magnetic fixer.

Abstract: A wafer to wafer bonding method includes performing a plasma process on a bonding surface of a first wafer, pressurizing the first wafer after performing the plasma process on the bonding surface of the first wafer, and bonding the first wafer to a second wafer. The plasma process has different plasma densities along a circumferential direction about a center of the first wafer. A middle portion of the first wafer protrudes after pressurizing the first wafer. The first wafer is bonded to the second wafer by gradually joining the first wafer to the second wafer from the middle portion of the first wafer to a peripheral region of the first wafer.

Abstract: An ultraviolet curing apparatus includes a housing, a plurality of ultraviolet light emitting diodes (LEDs) arranged in a length direction of the housing, and at least one shutter part coupled to the housing to be movable in the length direction, to cover at least a portion of the plurality of ultraviolet LEDs to limit an irradiation region of ultraviolet light emitted by the plurality of ultraviolet LEDs.

Abstract: A wafer to wafer bonding method includes performing a plasma process on a bonding surface of a first wafer, pressurizing the first wafer after performing the plasma process on the bonding surface of the first wafer, and bonding the first wafer to a second wafer. The plasma process has different plasma densities along a circumferential direction about a center of the first wafer. A middle portion of the first wafer protrudes after pressurizing the first wafer. The first wafer is bonded to the second wafer by gradually joining the first wafer to the second wafer from the middle portion of the first wafer to a peripheral region of the first wafer.

Abstract: A vacuum chuck for bonding substrates includes a chucking plate including vacuum holes to hold the substrate, partitions arranged in the chucking plate, the partitions dividing the chucking plate into regions, and a temperature control member in each one of the regions, the temperature control member to independently control temperature in each of the regions to selectively expand or contract portions of the substrate in contact with each of the regions.

Abstract: An ultraviolet curing apparatus includes a housing, a plurality of ultraviolet light emitting diodes (LEDs) arranged in a length direction of the housing, and at least one shutter part coupled to the housing to be movable in the length direction, to cover at least a portion of the plurality of ultraviolet LEDs to limit an irradiation region of ultraviolet light emitted by the plurality of ultraviolet LEDs.

Abstract: A substrate processing apparatus includes an exhaust unit including a lower surface in which an outlet is formed and four side walls extended from the lower surface, the exhaust unit having exhaust wings protruding from two opposing side walls, a shower head located in the exhaust unit and having distribution holes, and an adjuster disposed on each of side walls of the exhaust unit between the exhaust wings.

Abstract: An imprinting apparatus includes a first frame, a pressure roller rotatably supported on a first end of the first frame, a second frame including a support portion coupled to a second end of the first frame, and at least one guide portion coupled to the support portion to be laterally movable, and at least one load roller supported by the at least one guide portion, the at least one load roller being movable in a vertical direction while being rotatable and contacting a surface of the pressure roller on an upper portion of the pressure roller according to a lateral movement of the guide portion, the at least one load roller to press the pressure roller by force exerted by a load of the at least one load roller.

Abstract: An imprint apparatus including a stage supporting a stamp master on which a master pattern for forming a stamping pattern on a flexible substrate is formed, or a substrate on which a pattern corresponding to the stamping pattern is formed by contact with the stamping pattern; a roll-to-roll mover to move the flexible substrate along a path adjacent to the stage; a clamp including a front clamp that secures a first portion of the flexible substrate, and a rear clamp that secures a second portion of the flexible substrate spaced apart from the first portion; a pressure roller to press the flexible substrate so that the flexible substrate secured by the clamp is brought into contact with the substrate or the stamp master; and a clamp driving controller to drive the clamp to adjust tension between the first portion and the second portion.

Abstract: A film frame, a system for manufacturing a display substrate, and a method of manufacturing a display substrate, the film frame including a pair of frame edges extending lengthwise in a first direction and arranged opposite to each other; a fixed end clamp connected to the pair of frame edges and extending lengthwise in a second direction perpendicular to the first direction; and a free end clamp between the pair of frame edges, the free end clamp extending lengthwise in the second direction and configured to be detachably coupled with the pair of frame edges, wherein the fixed end clamp includes a first magnetic fixer extending lengthwise in the second direction and a second magnetic fixer on the first magnetic fixer, and the free end clamp includes a third magnetic fixer extending lengthwise in the second direction and a fourth magnetic fixer on the third magnetic fixer.

Abstract: Provided is a suspension spring for a shock absorber using carbon fiber reinforced plastic. From a structure including a spring unit in which a plurality of bowl-shaped unit bodies are stacked between a first sheet and a second sheet along a length direction of a piston rod, the suspension spring for the shock absorber can achieve weight reduction and durability improvement while exhibiting the same performance as that of steel coil spring by using the carbon fiber reinforced plastic.