Abstract: A semiconductor wafer marking apparatus and a semiconductor wafer marking method includes a laser head unit including a flowcell having a laser radiation region and a laser source radiating laser energy on the laser radiation region in response to an input current. An optical system radiates a laser beam on the semiconductor wafer. A cooling water reservoir stores cooling water. A pipe is disposed in the flowcell and connected to the cooling water reservoir. A marking interlock system detects leakage of cooling water from the pipe, an abnormal temperature of the laser radiation region, and an abnormal input current supplied to the laser source, and generates a marking interlock signal to terminate a marking operation of the semiconductor wafer. A marking unit turns off the laser source to terminate the marking of the semiconductor wafer in response to the marking interlock signal.

Abstract: In a semiconductor wafer marking apparatus having a marking interlock system and a semiconductor wafer marking method using the same, the semiconductor wafer marking apparatus includes a laser head unit including a flowcell having a laser radiation region on an upper surface thereof and a laser source radiating laser energy on the laser radiation region in response to an input current. An optical system focuses the laser energy radiated from the laser source to form a laser beam and radiates the laser beam on the semiconductor wafer. A cooling water reservoir stores cooling water. A pipe is disposed in the flowcell and connected to an inlet and an outlet of the cooling water reservoir. The cooling water flows through the pipe to maintain the laser radiation region of the flowcell at a constant temperature.