Patents by Inventor Kia S. Low

Kia S. Low has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IC having viabar interconnection and related method
    Patent number: 8492268
    Abstract: An IC including first metal layer having wiring running in a first direction; a second metal layer having wiring running in a second direction perpendicular to the first direction; and a first via layer between the first metal layer and the second metal layer, the first via layer including a viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: July 23, 2013
    Assignee: International Business Machines Corporation
    Inventors: Dureseti Chidambarrao, Stephen E. Greco, Kia S. Low
  • IC having viabar interconnection and related method
    Patent number: 8299622
    Abstract: An IC including first metal layer having wiring running in a first direction; a second metal layer having wiring running in a second direction perpendicular to the first direction; and a first via layer between the first metal layer and the second metal layer, the first via layer including a viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer.
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: October 30, 2012
    Assignee: International Business Machines Corporation
    Inventors: Dureseti Chidambarrao, Stephen E. Greco, Kia S. Low
  • IC HAVING VIABAR INTERCONNECTION AND RELATED METHOD
    Publication number: 20120164758
    Abstract: An IC including first metal layer having wiring running in a first direction; a second metal layer having wiring running in a second direction perpendicular to the first direction; and a first via layer between the first metal layer and the second metal layer, the first via layer including a viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer.
    Type: Application
    Filed: March 2, 2012
    Publication date: June 28, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dureseti Chidambarrao, Stephen E. Greco, Kia S. Low
  • IC HAVING VIABAR INTERCONNECTION AND RELATED METHOD
    Publication number: 20100032846
    Abstract: An IC including first metal layer having wiring running in a first direction; a second metal layer having wiring running in a second direction perpendicular to the first direction; and a first via layer between the first metal layer and the second metal layer, the first via layer including a viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer.
    Type: Application
    Filed: August 5, 2008
    Publication date: February 11, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dureseti Chidambarrao, Stephen E. Greco, Kia S. Low