Patents by Inventor Kian-Hock Tee

Kian-Hock Tee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sapphire collector for reducing mechanical damage during die level laser lift-off
    Patent number: 11342478
    Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: May 24, 2022
    Assignee: Lumileds LLC
    Inventors: Dong Nie, Kian Hock Tee
  • Sapphire collector for reducing mechanical damage during die level laser lift-off
    Patent number: 11311967
    Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure. The Sapphire Collector includes a vacuum-enhance collector with a pickup element that lifts each released chip into the collector, and air pushers that direct the chips further into the collection tunnel leading to a discard bin.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: April 26, 2022
    Assignee: Lumileds LLC
    Inventors: Dong Nie, Kian-Hock Tee
  • SAPPHIRE COLLECTOR FOR REDUCING MECHANICAL DAMAGE DURING DIE LEVEL LASER LIFT-OFF
    Publication number: 20180261715
    Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.
    Type: Application
    Filed: May 13, 2016
    Publication date: September 13, 2018
    Applicant: KONINKLIJKE PHILIPS N.V.
    Inventors: Dong NIE, Kian Hock TEE
  • SAPPHIRE COLLECTOR FOR REDUCING MECHANICAL DAMAGE DURING DIE LEVEL LASER LIFT-OFF
    Publication number: 20170274474
    Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure. The Sapphire Collector includes a vacuum-enhance collector with a pickup element that lifts each released chip into the collector, and air pushers that direct the chips further into the collection tunnel leading to a discard bin.
    Type: Application
    Filed: July 29, 2015
    Publication date: September 28, 2017
    Inventors: Dong Nie, Kian-Hock Tee