Patents by Inventor Kian Leong Chin

Kian Leong Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package with voltage distributor
    Patent number: 9331046
    Abstract: An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: May 3, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Chu-Chung Lee, Kian Leong Chin, Kevin J. Hess, James Patrick Johnston, Tu-Anh N. Tran, Heng Keong Yip
  • INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR
    Publication number: 20140308779
    Abstract: An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.
    Type: Application
    Filed: June 26, 2014
    Publication date: October 16, 2014
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Chu-Chung LEE, Kian Leong CHIN, Kevin J. HESS, Patrick P. JOHNSTON, Tu-Anh N. TRAN, Heng Keong YIP
  • Integrated circuit package with voltage distributor
    Patent number: 8791582
    Abstract: An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: July 29, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Chu-Chung Lee, Kian Leong Chin, Kevin J. Hess, Patrick Johnston, Tu-Anh N. Tran, Heng Keong Yip
  • INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR
    Publication number: 20120025401
    Abstract: An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.
    Type: Application
    Filed: July 28, 2010
    Publication date: February 2, 2012
    Inventors: CHU-CHUNG LEE, Kian Leong Chin, Kevin J. Hess, Patrick Johnston, Tu-Anh N. Tran, Heng Keong Yip