Patents by Inventor Kiat Heng Tee

Kiat Heng Tee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND APPARATUS FOR APPLYING AN ADHESIVE TO A CIRCUIT BOARD
    Publication number: 20120288996
    Abstract: Methods and apparatus for curing an adhesive on a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes isolating a first portion of a surface of a circuit board from a second portion of the surface with a flexible gasket. An adhesive is applied to the first portion of the surface. The adhesive is thermally cured. The flexible gasket prevents constituents outgassed from the adhesive from contaminating the second portion of the surface.
    Type: Application
    Filed: May 12, 2011
    Publication date: November 15, 2012
    Inventors: Seah S. Too, Kiat Heng Tee