Abstract: Various embodiments generally relate to a power distribution network and a semiconductor device, which may include: a plurality of chip pads; a first distribution layer in which a plurality of first conductive lines having rectangular shapes of different sizes, respectively, are disposed; a second distribution layer in which a plurality of second conductive lines including a central cross-shaped conductive line and L-shaped conductive lines open toward respective corners of the second distribution layer are disposed; and a redistribution layer electrically coupling chip pads to which power is applied among the plurality of chip pads and the first conductive lines of the first distribution layer.

Abstract: Provided is a phase shifter using a substrate integrated waveguide (SIW). The phase shifter includes: a substrate; and a waveguide integrated on the substrate, wherein the waveguide includes an input port, an out port, two columns of via walls which are separated by a width of the waveguide and are arranged parallel to each other, and either a plurality of air holes which are formed to shift a phase of a signal between the input port and the output port or a plurality of rods, each including an air hole and a dielectric material inserted into the air hole.

Abstract: Provided is a phase shifter using a substrate integrated waveguide (SIW). The phase shifter includes: a substrate; and a waveguide integrated on the substrate, wherein the waveguide includes an input port, an out port, two columns of via walls which are separated by a width of the waveguide and are arranged parallel to each other, and either a plurality of air holes which are formed to shift a phase of a signal between the input port and the output port or a plurality of rods, each including an air hole and a dielectric material inserted into the air hole.