Patents by Inventor Ki Hyeon Kim
Ki Hyeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240118607Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.Type: ApplicationFiled: March 14, 2023Publication date: April 11, 2024Applicant: SEMES CO.,LTD.Inventors: Hyun YOON, Ki Hoon CHOI, Seung Un OH, Young Ho PARK, Sang Hyeon RYU, Tae Hee KIM, Sang Gun LEE
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Publication number: 20240104195Abstract: Disclosed herein are an apparatus and method for updating an Internet-based malware detection engine using virtual machine scaling. The method may include creating a scaling group and an update group set based on a first virtual machine image, creating a second virtual machine image for a running virtual machine in response to occurrence of a snapshot event in the virtual update group run based on the first virtual machine image, modifying the scale-out image of the scaling group to the second virtual machine image, updating the scaling group by triggering a scale-out event and a scale-in event in the scaling group in response to occurrence of an update event, and modifying the scale-in image of the scaling group to the second virtual machine image.Type: ApplicationFiled: June 15, 2023Publication date: March 28, 2024Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sang-Min LEE, Ki-Jong KOO, Jung-Tae KIM, Ji-Hyeon SONG, Jong-Hyun KIM, Dae-Sung MOON
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Publication number: 20240083018Abstract: An embodiment device includes an input module including a motor configured to generate a rotational force, an output module configured to receive power from the input module to be rotatable, and a connection module having a first side coupled to the input module and a second side, opposite the first side, coupled to the output module, wherein the connection module is configured to transmit the power from the input module to the output module.Type: ApplicationFiled: February 9, 2023Publication date: March 14, 2024Inventors: Hyo-Joong Kim, Sang In Park, Ki Hyeon Bae, Ju Young Yoon, Beom Su Kim, Min Woong Jeung, Seong Taek Hwang, Ho Jun Kim, Hyun Seop Lim, Kyu Jung Kim
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Patent number: 11924803Abstract: Provided are methods and devices for performing positioning in a next-generation wireless network. The method of a UE for performing positioning include identifying configuration information for a transmission bandwidth of a positioning reference signal (PRS) configured per cell and receiving the positioning reference signal corresponding to each cell based on the configuration information for the transmission bandwidth.Type: GrantFiled: April 8, 2019Date of Patent: March 5, 2024Assignee: KT CORPORATIONInventors: Ki-tae Kim, Woo-jin Choi, Ki-Hyeon Park
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Publication number: 20230344025Abstract: Provided is a battery module assembly in which unit modules are stacked. Each of the unit modules includes: a plurality of battery cells; and a plurality of cartridge assemblies for respectively fixing the plurality of battery cells. The battery module assembly includes: a sensing assembly mounted to upper ends of the plurality of cartridge assemblies and assembled thereto; a front cover for covering front surfaces of the cartridge assemblies; and a connector coupled and fixed to the front cover. The connector includes: a connector body; and a first protrusion region that protrudes from the connector body. An upper sensing assembly connection hole is formed in an upper region of each of the cartridge assemblies.Type: ApplicationFiled: September 9, 2022Publication date: October 26, 2023Applicant: HYUNDAI MOBIS Co., Ltd.Inventors: Geum Hyeon LEE, Ki Hyeon KIM
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Publication number: 20230261329Abstract: Disclosed is a battery module including a battery assembly, in which multiple batteries are stacked, and a bus bar housing assembly that surrounds an upper side of the battery assembly. The bus bar housing assembly may include a temperature sensing part including a temperature sensor that has a first fixing hole and measures temperature, and a voltage sensing part including a pressure sensor that has a second fixing hole and measures pressure. The battery module also included a bus bar coupled to the temperature sensing part and the voltage sensing part, and a bus bar housing, coupled to the bus bar, surrounding an upper surface of the battery assembly, and extending downwards from opposite ends in leftward and rightward directions to surround a side surface of the battery assembly.Type: ApplicationFiled: December 22, 2022Publication date: August 17, 2023Applicant: HYUNDAI MOBIS CO., LTD.Inventors: Yun Su PARK, Ki Hyeon KIM
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Patent number: 11637338Abstract: A battery module assembly with a plurality of unit modules stacked therein is provided. Each of the plurality of unit modules includes a cartridge including a cooling plate having a plate shape and two pouch type battery cells mounted on each of both side surfaces of the cooling plate with the cartridge therebetween. A partition having a tetragonal frame shape and including an internal empty space is disposed between adjacent unit modules among the plurality of unit modules.Type: GrantFiled: August 20, 2020Date of Patent: April 25, 2023Assignee: HYUNDAI MOBIS CO., LTD.Inventor: Ki Hyeon Kim
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Publication number: 20230055817Abstract: A lower case of a battery module and a method for manufacturing the lower case that can reduce costs by manufacturing a cooling block using a press method, and can further strengthen safety problem due to a leakage of cooling water. There is provided a lower case of a battery module including a lower case in which a battery is mounted, a lower panel assembled to the lower case, a cooling block attached to the lower panel and configured to form a cooling passage between the lower panel and the cooling block, and nipples mounted in the lower case to introduce and withdraw cooling water into and from the cooling passage, and a manufacturing method thereof.Type: ApplicationFiled: August 19, 2022Publication date: February 23, 2023Applicant: HYUNDAI MOBIS Co., Ltd.Inventor: Ki Hyeon KIM
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Publication number: 20210057692Abstract: A battery module assembly with a plurality of unit modules stacked therein is provided. Each of the plurality of unit modules includes a cartridge including a cooling pin having a plate shape and two pouch type battery cells mounted on each of both side surfaces of the cooling pin with the cartridge therebetween. A partition having a tetragonal frame shape and including an internal empty space is disposed between adjacent unit modules among the plurality of unit modules.Type: ApplicationFiled: August 20, 2020Publication date: February 25, 2021Applicant: HYUNDAI MOBIS Co., Ltd.Inventor: Ki Hyeon KIM
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Patent number: 9929475Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.Type: GrantFiled: May 9, 2011Date of Patent: March 27, 2018Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALSInventors: Sang-Kwan Lee, Sang-Bok Lee, Ki Hyeon Kim, Yong-Ho Choa, Sung-Tag Oh
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Patent number: 9562299Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.Type: GrantFiled: January 15, 2014Date of Patent: February 7, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Myung-Beom Park, Yun-Deok Kang, Ki-Hyeon Kim, Youn-Joung Cho, Jung-Sik Choi
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Patent number: 8795505Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:Type: GrantFiled: November 7, 2011Date of Patent: August 5, 2014Assignees: Samsung Electronics Co., Ltd., Adeka CorporationInventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
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Publication number: 20140197038Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.Type: ApplicationFiled: January 15, 2014Publication date: July 17, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Myung-Beom PARK, Yun-Deok KANG, Ki-Hyeon KIM, Youn-Joung CHO, Jung-Sik CHOI
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Publication number: 20130140076Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.Type: ApplicationFiled: May 9, 2011Publication date: June 6, 2013Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALSInventors: Sang-Kwan Lee, Sang-Bok Lee, Ki Hyeon Kim, Yong-Ho Choa, Sung-Tag Oh
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Publication number: 20120211369Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:Type: ApplicationFiled: November 7, 2011Publication date: August 23, 2012Inventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
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Publication number: 20120193238Abstract: A composition for plating copper includes an electrolyte solution, an accelerator, a suppressor and a leveler. The electrolyte solution includes a soluble copper salt, sulfuric acid and hydrochloric acid. The accelerator includes about 20 to about 60 ppm of a disulfide compound. The suppressor includes about 40 to about 100 ppm of a polyethyleneoxide (PEO)-polypropyleneoxide (PPO)-polyethyleneoxide (PEO) triblock copolymer. The PEO-PPO-PEO triblock copolymer has a weight average molecular weight of about 300 to about 10,000. The leveler includes about 0.01 to about 100 ppm of arylated polyethyleneimine.Type: ApplicationFiled: November 2, 2011Publication date: August 2, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Myung-Beom Park, Ki-Hyeon Kim, Jung-Sik Choi, Jung-Ho Lee
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Publication number: 20070287280Abstract: A composition for removing a photoresist and a method of forming a bump electrode using the composition are provided. The composition includes an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water. The method of forming the bump electrode includes forming a conductive pattern on a substrate, forming a passivation layer on the substrate, the passivation layer having a first opening that partially exposes the conductive pattern, forming a photoresist pattern on the passivation layer, the photoresist pattern having a second opening that exposes the first opening forming a bump electrode that fills the first opening and the second opening, and removing the photoresist pattern from the substrate using a composition including an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water.Type: ApplicationFiled: June 12, 2007Publication date: December 13, 2007Inventors: Dong-Min Kang, Young-Sam Lim, Gi-Jung Kim, Young-Nam Kim, Yun-Deok Kang, Ji-Sung Lee, Ki-Hyeon Kim, Kyoung-Jin Choi
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Patent number: 6649286Abstract: Disclosed is a FeCoNiN-based soft magnetic thin film composition having the formula FexCoyNizNv, wherein x, y, z and v are expressed in at % and satisfy 41≦x≦55, 18≦y≦27, 19≦z≦32, 0<v≦5, and x+y+z+v=100. The Fe-based ultrafine crystalline soft magnetic thin film composition is prepared by the more simplified method and much more excellent soft magnetic properties in the high-frequency than the conventional soft magnetic thin film compositions.Type: GrantFiled: April 20, 2001Date of Patent: November 18, 2003Assignee: Korea Institute of Science and TechnologyInventors: Hi Jung Kim, Suk Hee Han, Ki Hyeon Kim, Yun Myung Kim
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Publication number: 20020160229Abstract: Disclosed is a FeCoNiN-based soft magnetic thin film composition having the formula FexCoyNizNv, wherein x, y, z and v are expressed in at % and satisfy 41≦x≦55, 18≦y≦27, 19≦z≦32, 0<v≦5, and x+y+z+v=100. The Fe-based ultrafine crystalline soft magnetic thin film composition is prepared by the more simplified method and much more excellent soft magnetic properties in the high-frequency than the conventional soft magnetic thin film compositions.Type: ApplicationFiled: April 20, 2001Publication date: October 31, 2002Inventors: Hi Jung Kim, Suk Hee Han, Ki Hyeon Kim, Yun Myung Kim