Patents by Inventor Kiichi Nakamura

Kiichi Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4987009
    Abstract: A thick film complex electronic component mounted on a substrate including an inductance, capacitance and/or resistance by a conductive film and a magnetic film on a ceramic substrate is improved by novel magnetic film. The magnetic film is produced by depositing paste of a raw material of ferrite on the substrate, and the paste together with the substrate are sintered at a relatively low temperature in the range of 600.degree. C. and 1200.degree. C. The present magnetic film which is sintered after the raw material of ferrite is deposited on the ceramic substrate has higher permeability and is mechanically stronger.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: January 22, 1991
    Assignee: TDK Corporation
    Inventors: Kiichi Nakamura, Masami Itakura, Yasuhiko Atsumi, Hideo Watanabe, Youiti Kanagawa
  • Patent number: 4260965
    Abstract: A fixed attenuator for microwave band comprising of a dielectric substrate, with a resistance film and a conductor film attached on said substrate so as to form an attenuation circuit. The substrate further comprises of at least one hole provided through the dielectric substrate. The attenuator is mounted on a metallic board or a printed circuit board by a screw inserted in said hole. Thus, the cooling effect of the resistance film has been improved while keeping the low manufacturing cost and stable structure, by fixing the dielectric substrate on a metallic board by screws inserted in the mentioned holes.
    Type: Grant
    Filed: July 5, 1979
    Date of Patent: April 7, 1981
    Assignee: TDK Electronics Co., Inc.
    Inventors: Kiichi Nakamura, Takashi Iwata
  • Patent number: 3971124
    Abstract: A method for manufacturing a cylindrical armature having an armature winding arranged cylindrically and a cylindrical insulating layer formed at least on the outer peripheral surface of the cylindrical armature winding by winding an insulating material impregnated with thermosetting resin is disclosed. The insulating material is wound over the armature winding and on a jig adapted to be separated into an effective part corresponding to the cylindrical armature winding and a remaining ineffective part. After hardening the resin, the part of the insulating layer on the ineffective part is separated, together with the jig, from the effective part.
    Type: Grant
    Filed: September 5, 1975
    Date of Patent: July 27, 1976
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Sasaki, Kiichi Nakamura