Patents by Inventor Kiichiro Matsushita
Kiichiro Matsushita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220325143Abstract: A method for releasing an adherend of the present invention includes a first step and a second step. In the first step, a bonded product (100) including a pressure-sensitive adhesive layer (10), and an adherend (20) bonded thereto is prepared. The pressure-sensitive adhesive layer (10) includes a pressure-sensitive adhesive component and a heat-expandable agent. In the second step, an energy ray (R) is irradiated from the pressure-sensitive adhesive layer (10)-side of the bonded product (100) toward the adherend (20). A transmittance of the energy ray (R) in the pressure-sensitive adhesive layer (10) is 60% or more. The pressure-sensitive adhesive composition of the present invention is a composition used for forming the pressure-sensitive adhesive layer (10) in the method.Type: ApplicationFiled: March 19, 2020Publication date: October 13, 2022Applicant: NITTO DENKO CORPORATIONInventors: Mizuho NAGATA, Yu TACHIKAWA, Keisuke HIRANO, Kiichiro MATSUSHITA
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Publication number: 20220280986Abstract: A method for releasing an adherend of the present invention includes a first step and a second step. In the first step, a bonded product (100) including a pressure-sensitive adhesive layer (10), and an adherend (20) bonded thereto is prepared. The pressure-sensitive adhesive layer (10) includes a pressure-sensitive adhesive component and a gas generating agent. In the second step, a laser light (L) is irradiated to the pressure-sensitive adhesive layer (10)-side of the bonded product (100) to heat a part of the pressure-sensitive adhesive layer (10). A pressure-sensitive adhesive composition of the present invention is a composition used for forming the pressure-sensitive adhesive layer (10) in the method.Type: ApplicationFiled: March 19, 2020Publication date: September 8, 2022Applicant: NITTO DENKO CORPORATIONInventors: Mizuho NAGATA, Yu TACHIKAWA |, Keisuke HIRANO, Kiichiro MATSUSHITA
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Publication number: 20220025223Abstract: A pressure-sensitive adhesive composition contains an adhesive component and gas-generative particles dispersed in the adhesive component. When the gas-generative particles are subjected to particle size distribution measurement, in the particle size distribution of the gas-generative particles, a cumulative particle size (D90) where a cumulative value from the smallest particle size is 90% based on volume is 10.0 ?m or less.Type: ApplicationFiled: December 9, 2019Publication date: January 27, 2022Applicant: NITTO DENKO CORPORATIONInventors: Mizuho NAGATA, Yu TACHIKAWA, Keisuke HIRANO, Kiichiro MATSUSHITA
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Publication number: 20220017789Abstract: A pressure-sensitive adhesive composition includes a pressure-sensitive adhesive component and a gas generating particle dispersed in the pressure-sensitive adhesive component. A tensile elastic modulus at 25° C. of the pressure-sensitive adhesive composition is 5 MPa or less. A gas generation amount at which the gas generating particle is generated in the pressure-sensitive adhesive composition is 5 mL/g or more in terms of decane at 0° C. and 1013 hPa in a solid content of the pressure-sensitive adhesive composition.Type: ApplicationFiled: November 12, 2019Publication date: January 20, 2022Applicant: NITTO DENKO CORPORATIONInventors: Mizuho NAGATA, Yu TACHIKAWA, Keisuke HIRANO, Kiichiro MATSUSHITA
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Patent number: 11104826Abstract: Provided is a PSA sheet capable of providing greater air release properties. The present invention provides a release-linered PSA sheet comprising a PSA sheet and a release liner covering an adhesive face of the PSA sheet. The PSA sheet has a coating layer that partially forms the adhesive face. The release liner has an arithmetic average roughness of 0.1 ?m or greater on the PSA sheet side surface.Type: GrantFiled: April 10, 2017Date of Patent: August 31, 2021Assignee: NITTO DENKO CORPORATIONInventors: Shuuhei Yamamoto, Kiichiro Matsushita
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Publication number: 20210179893Abstract: A pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer having an adhesive strength reducible by an adhesive strength-reducing action. For example, the pressure-sensitive adhesive layer is a thermally releasable pressure-sensitive adhesive layer (11), and the adhesive strength-reducing action is heating of the pressure-sensitive adhesive layer (11). This pressure-sensitive adhesive sheet for build stage use is suitable for allowing an object to be formed over a build stage of an additive manufacturing apparatus to be attached to the build stage during building up, and to be readily detached from the build stage after building up. An additive manufacturing apparatus can employ the pressure-sensitive adhesive sheet for build stage use and includes a build stage, and adhesive strength-reducing means for performing an adhesive strength-reducing action to a pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for build stage use affixed to the stage.Type: ApplicationFiled: March 7, 2017Publication date: June 17, 2021Applicant: Nitto Denko CorporationInventors: Yoshiko OGINO, Yutaka TOSAKI, Michiro KAWANISHI, Kiichiro MATSUSHITA, Akiko NONAKA, Akihisa MURATA
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Patent number: 10596792Abstract: Provided is a PSA sheet capable of bringing about good air release properties in mobile electronic applications. The present invention provides a PSA sheet for mobile electronics. The PSA sheet comprises a substrate film and a PSA layer provided to at least one face of the substrate film. The PSA layer has a thickness of 20 ?m or less. The PSA sheet further comprises a coating layer that partially covers the PSA layer surface. The coating layer has a thickness less than 3 ?m.Type: GrantFiled: November 27, 2015Date of Patent: March 24, 2020Assignee: NITTO DENKO CORPORATIONInventors: Shuuhei Yamamoto, Kiichiro Matsushita
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Publication number: 20200009789Abstract: Provided is a build mat to which a 3D print sticks well and from which the 3D print is easily separated. The build mat provided by this invention comprises a substrate and a surface layer provided to the first face of the substrate. The build mat has a peel strength of 1.5 N/18 mm or greater and 10 N/18 mm or less, determined by peeling the mat from polylactic acid (PLA) placed on the surface layer; and it is constituted so that the surface layer remains on the PLA in the peel strength measurement.Type: ApplicationFiled: February 27, 2018Publication date: January 9, 2020Applicant: NITTO DENKO CORPORATIONInventors: Yoshiko OGINO, Kiichiro MATSUSHITA, Akihisa MURATA, Tsunaki KITAHARA, Akiko NONAKA
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Publication number: 20190144716Abstract: Provided is a PSA sheet capable of providing greater air release properties. The present invention provides a release-linered PSA sheet comprising a PSA sheet and a release liner covering an adhesive face of the PSA sheet. The PSA sheet has a coating layer that partially forms the adhesive face. The release liner has an arithmetic average roughness of 0.1 ?m or greater on the PSA sheet side surface.Type: ApplicationFiled: April 10, 2017Publication date: May 16, 2019Applicant: NITTO DENKO CORPORATIONInventors: Shuuhei YAMAMOTO, Kiichiro MATSUSHITA
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Patent number: 10160885Abstract: A double-sided pressure-sensitive adhesive tape includes a support base member having a hand tearable property, a first acrylic adhesive layer on one surface of the support base member, and a second acrylic adhesive layer on another surface of the support base member. The first acrylic adhesive layer has a thickness t1 that is 5 ?m or more and 50 ?m or less, the second acrylic adhesive layer has a thickness t2 that is greater than the thickness t1 of the first acrylic adhesive layer and is 20 ?m or more, the second acrylic adhesive layer has gel fraction X2 that is 20 mass % or more and 75 mass % or less, and the second acrylic adhesive layer has adhesive force greater than adhesive force of the first acrylic adhesive layer.Type: GrantFiled: February 23, 2016Date of Patent: December 25, 2018Assignee: NITTO DENKO CORPORATIONInventors: Takatoshi Kawamoto, Izumi Shimizu, Ikkou Hanaki, Kiichiro Matsushita
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Patent number: 10105929Abstract: A foamed sheet according to the present invention has a thickness of 30 to 500 ?m and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 ?m, and a peak top of loss tangent (tan ?) occurring in a temperature range of from ?30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan ?) in the temperature range of from ?30° C. to 30° C. of 0.2 or more.Type: GrantFiled: August 21, 2014Date of Patent: October 23, 2018Assignee: NITTO DENKO CORPORATIONInventors: Kohei Doi, Kunio Nagasaki, Tetsuya Otsuka, Mika Okada, Kazumichi Kato, Hideyuki Tokuyama, Tsunaki Kitahara, Tadao Takahashi, Kiichiro Matsushita
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Publication number: 20170335142Abstract: Provided is a PSA sheet capable of bringing about good air release properties in mobile electronic applications. The present invention provides a PSA sheet for mobile electronics. The PSA sheet comprises a substrate film and a PSA layer provided to at least one face of the substrate film. The PSA layer has a thickness of 20 ?m or less. The PSA sheet further comprises a coating layer that partially covers the PSA layer surface. The coating layer has a thickness less than 3 ?m.Type: ApplicationFiled: November 27, 2015Publication date: November 23, 2017Applicant: NITTO DENKO CORPORATIONInventors: Shuuhei YAMAMOTO, Kiichiro MATSUSHITA
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Publication number: 20170306185Abstract: Provided is a masking sheet for anodizing, the masking sheet comprising a substrate having first and second faces, and a PSA layer placed on the first face side of the substrate. Here, the substrate is a non-metal substrate. The elastic modulus Et? of the masking sheet and the thickness Hs of the substrate satisfy the next relation 0.7 N/mm<Et?·Hs3.Type: ApplicationFiled: October 1, 2015Publication date: October 26, 2017Applicant: NITTO DENKO CORPORATIONInventors: Kosuke MORITA, Shuuhei YAMAMOTO, Takafumi HIDA, Shigeki MUTA, Kiichiro MATSUSHITA
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Publication number: 20170292042Abstract: Provided is a masking sheet for chemical solution treatment, the masking sheet comprising a substrate having first and second faces, and a PSA layer placed on the first face side of the substrate. The masking sheet is constituted so that penetration of a chemical solution is visually detectable when inspected from the outer face of the masking sheet.Type: ApplicationFiled: October 1, 2015Publication date: October 12, 2017Applicant: NITTO DENKO CORPORATIONInventors: Kosuke MORITA, Shuuhei YAMAMOTO, Takafumi HIDA, Shigeki MUTA, Kiichiro MATSUSHITA
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Publication number: 20170267897Abstract: Provided is a PSA sheet capable of showing high long-term adhesive strength and good air release properties between the PSA sheet and an adherend. This invention provides a PSA sheet comprising a substrate film and a PSA layer provided to at least one face of the substrate film. The PSA sheet comprises a coating layer partially covering the PSA layer surface, whereby the PSA layer surface has a coating layer-bearing area and a coating layer-free area. The coating layer-free area occupies 70% or more of the PSA layer surface. In a top view of the PSA layer surface, the coating layer-bearing area has a linearly extending part running from one edge to another edge of the PSA layer. The linearly extending part has a width in a range of 0.1 mm to 2 mm.Type: ApplicationFiled: November 27, 2015Publication date: September 21, 2017Applicant: Nitto Denko CorporationInventors: Shuuhei YAMAMOTO, Kiichiro MATSUSHITA
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Publication number: 20170260425Abstract: Provided is a PSA sheet with which good air release properties can be obtained while whose quality can be further enhanced. This invention provides a PSA sheet comprising a substrate film and a PSA layer provided to at least one face of the substrate film. The PSA sheet further comprises a coating layer partially covering the PSA layer surface. The PSA sheet's adhesive is formed of the PSA layer and the coating layer. The coating layer has a linearly extending part running from one edge to another edge of the adhesive face. The linearly extending part has a first face forming the PSA sheet's adhesive face and a second face located on the PSA layer side relative to the first face. The second face of the linearly extending part forms an overall gently curved line in a cross section perpendicularly intersecting the length direction of the linearly extending part.Type: ApplicationFiled: November 27, 2015Publication date: September 14, 2017Applicant: NITTO DENKO CORPORATIONInventors: Shuuhei YAMAMOTO, Kiichiro MATSUSHITA
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Publication number: 20170226384Abstract: A double-sided pressure-sensitive adhesive tape includes a support base member having a hand tearable property, a first acrylic adhesive layer on one surface of the support base member, and a second acrylic adhesive layer on another surface of the support base member. The first acrylic adhesive layer has a thickness t1 that is 5 ?m or more and 50 ?m or less, the second acrylic adhesive layer has a thickness t2 that is greater than the thickness t1 of the first acrylic adhesive layer and is 20 ?m or more, the second acrylic adhesive layer has gel fraction X2 that is 20 mass % or more and 75 mass % or less, and the second acrylic adhesive layer has adhesive force greater than adhesive force of the first acrylic adhesive layer.Type: ApplicationFiled: February 23, 2016Publication date: August 10, 2017Applicant: NITTO DENKO CORPORATIONInventors: Takatoshi KAWAMOTO, Izumi SHIMIZU, Ikkou HANAKI, Kiichiro MATSUSHITA
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Publication number: 20160221299Abstract: A foamed sheet according to the present invention has a thickness of 30 to 500 ?m and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 ?m, and a peak top of loss tangent (tan ?) occurring in a temperature range of from ?30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan ?) in the temperature range of from ?30° C. to 30° C. of 0.2 or more.Type: ApplicationFiled: August 21, 2014Publication date: August 4, 2016Applicant: NITTO DENKO CORPORATIONInventors: Kohei DOI, Kunio NAGASAKI, Tetsuya OTSUKA, Mika OKADA, Kazumichi KATO, Hideyuki TOKUYAMA, Tsunaki KITAHARA, Tadao TAKAHASHI, Kiichiro MATSUSHITA
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Publication number: 20140127494Abstract: An object of the present invention is to provide a polyimide porous body having an excellent heat resistance, a fine cell structure, and a low relative dielectric constant, and a method for producing the polyimide porous body. The present invention relates to a method for producing a polyimide porous body, comprising a step for applying a polymer solution containing a polyamide acid, a phase separation agent for separating the phases of the polyamide acid, an imidization catalyst, and a dehydrating agent, on a substrate, and drying the polymer solution to produce a phase-separated structure body having a microphase-separated structure; a step for producing a porous body by removing the phase separation agent from the phase-separated structure body; and a step for subjecting the polyamide acid in the porous body to imidization to synthesize a polyimide.Type: ApplicationFiled: May 28, 2012Publication date: May 8, 2014Applicant: NITTO DENKO CORPORATIONInventors: Shinpei Yakuwa, Takeshi Sutou, Keiko Akiyama, Kiichiro Matsushita
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Patent number: 8603618Abstract: An object of the present invention is to provide a polyamide imide resin composition having excellent in heat resistance, mechanical strength, and tracking resistance. The polyamide imide resin composition includes a polymer blend of a polyamide imide resin including an alicyclic structure and an aromatic polyamide imide resin.Type: GrantFiled: November 8, 2011Date of Patent: December 10, 2013Assignee: Nitto Denko CorporationInventors: Shunsuke Masaki, Kiichiro Matsushita