Patents by Inventor Kiju Kim

Kiju Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240145444
    Abstract: A semiconductor package is provided and includes: a first redistribution structure including a first redistribution pattern and a first redistribution insulating layer, wherein the first redistribution pattern includes a first redistribution via extending in a vertical direction within the first redistribution insulating layer; a second redistribution structure on the first redistribution structure and including a second redistribution pattern and a second redistribution insulating layer, wherein the second redistribution pattern includes a lower redistribution pad at a lower surface of the second redistribution insulating layer; a first semiconductor chip on the second redistribution structure; and a second semiconductor chip on the first semiconductor chip.
    Type: Application
    Filed: July 7, 2023
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kiju Lee, Jinsu Kim, Hyunsuk Yang, Byoungwook Jang
  • METHOD OF PROVIDING MORE BIGGER EFFECT OF BUTTON
    Publication number: 20090315741
    Abstract: The present invention has to do with the method of increasing the efficiency of buttons on electric and electronic devices. To elaborate, the purpose of the invention is to enhance convenience and efficiency by improving areas of difficulty when operating buttons on computer keyboards, telephone varieties keyboards, electronic calculator keypads, etc.
    Type: Application
    Filed: January 21, 2008
    Publication date: December 24, 2009
    Inventor: KiJu Kim
  • Plastic system and method of porous bioimplant having a unified connector
    Patent number: 7347967
    Abstract: The present invention relates to a system and a method of manufacturing a porous bio-implant having a connecting member integrally formed therewith, and more particularly, to a system and a method of manufacturing a porous bio-implant in which a connecting member is integrally formed by sintering a metal powder by a high voltage instant discharge in the state that the connecting member is inserted in a pyrex tube and then the metal powder is put in the pyrex tube.
    Type: Grant
    Filed: November 3, 2001
    Date of Patent: March 25, 2008
    Assignee: Isan Biotech Co.
    Inventors: Kiju Kim, Wonhee Lee, Jongkyun Jung
  • Plastic system and method of porous bioimplant having a unified connector
    Publication number: 20040076538
    Abstract: The present ivention relates to a system and a method of manufacturing a porous bio-implant having a connecting member integrally formed therewith, and more particularly, to a system and a method of manufacturing a porous bio-implant in which a connecting member is integrally formed by sintering a metal powder by a high voltage instant discharge in the state that the connecting member is inserted in a pyrex tube and then the metal powder is put in the pyrex tube.
    Type: Application
    Filed: September 2, 2003
    Publication date: April 22, 2004
    Inventors: Kiju Kim, Wonhee Lee, Jongkyun Jung