Abstract: An electronic device includes a housing that defines an aperture, and a display assembly positioned in the aperture. The display assembly can include a display layer having a first portion, and a second portion bending at least partially below the first portion. The first portion and the second portion can define a bend volume, and a potting material can be disposed in the bend volume, such that the potting material contacts the first portion and the second portion. An internal enclosure can be contoured to the display assembly.

Abstract: An electronic device includes a housing that defines an aperture, and a display assembly positioned in the aperture. The display assembly can include a display layer having a first portion, and a second portion bending at least partially below the first portion. The first portion and the second portion can define a bend volume, and a potting material can be disposed in the bend volume, such that the potting material contacts the first portion and the second portion. An internal enclosure can be contoured to the display assembly.

Abstract: A curable thermal interface material composition includes an epoxy polymeric adhesive matrix; a high conductivity filler; a low melting temperature solder material; and a matrix material modification agent.

Abstract: The invention concerns a method for applying a surface modification agent composition for organosilicate glass dielectric films. More particularly, the invention pertains to a method for treating a silicate or organosilicate dielectric film on a substrate, which film either comprises silanol moieties or has had at least some previously present carbon containing moieties removed therefrom. The treatment adds carbon containing moieties to the film and/or seals surface pores of the film, when the film is porous.

Abstract: Thermal interface materials comprise at least one silicon-based polymer and are formed from a combination of at least one silicon-based material, at least one catalyst and at least one elasticity promoter. In some embodiments, contemplated materials are also formed utilizing at least one polymerization component. Thermal interface materials are also disclosed that are capable of withstanding temperatures of at least 250 C where the material comprises at least one silicon-based polymer coupled with at least one elasticity promoter. Methods of forming these thermal interface materials comprise providing each of the at least one silicon-based material, at least one catalyst and at least one elasticity promoter, blending the components and optionally including the at least one polymerization component. Contemplated thermal interface materials disclosed are thermally stable, sticky, and elastic, and show a good thermal conductivity and strong adhesion when deposited on the high thermally conductive material.

Abstract: Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component.