Patents by Inventor Kil Dong Son

Kil Dong Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method of manufacturing the same
    Patent number: 11889634
    Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: January 30, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jung Ho Hwang, Han Su Lee, Dae Young Choi, Soon Gyu Kwon, Dong Hun Jeong, In Ho Jeong, Kil Dong Son, Sang Hwa Kim, Sang Young Lee, Jae Hoon Jeon, Jin Hak Lee, Yun Mi Bae
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210120677
    Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Inventors: Jung Ho HWANG, Han Su LEE, Dae Young CHOI, Soon Gyu KWON, Dong Hun JEONG, In Ho JEONG, Kil Dong SON, Sang Hwa KIM, Sang Young LEE, Jae Hoon JEON, Jin Hak LEE, Yun Mi BAE
  • Method of manufacturing printed circuit board
    Patent number: 10912202
    Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: February 2, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jung Ho Hwang, Han Su Lee, Dae Young Choi, Soon Gyu Kwon, Dong Hun Jeong, In Ho Jeong, Kil Dong Son, Sang Hwa Kim, Sang Young Lee, Jae Hoon Jeon, Jin Hak Lee, Yun Mi Bae
  • Printed circuit board and method of manufacturing the same
    Patent number: 9820378
    Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: November 14, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jung Ho Hwang, Han Su Lee, Dae Young Choi, Soon Gyu Kwon, Dong Hun Jeong, In Ho Jeong, Kil Dong Son, Sang Hwa Kim, Sang Young Lee, Jae Hoon Jeon, Jin Hak Lee, Yun Mi Bae
  • Printed Circuit Board And Method Of Manufacturing The Same
    Publication number: 20170135223
    Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.
    Type: Application
    Filed: January 13, 2017
    Publication date: May 11, 2017
    Inventors: Jung Ho Hwang, Han Su Lee, Dae Young Choi, Soon Gyu Kwon, Dong Hun Jeong, In Ho Jeong, Kil Dong Son, Sang Hwa Kim, Sang Young Lee, Jae Hoon Jeon, Jin Hak Lee, Yun Mi Bae
  • Printed Circuit Board And Method Of Manufacturing The Same
    Publication number: 20170055347
    Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.
    Type: Application
    Filed: August 19, 2016
    Publication date: February 23, 2017
    Inventors: Jung Ho Hwang, Han Su Lee, Dae Young Choi, Soon Gyu Kwon, Dong Hun Jeong, In Ho Jeong, Kil Dong Son, Sang Hwa Kim, Sang Young Lee, Jae Hoon Jeon, Jin Hak Lee, Yun Mi Bae