Abstract: A semiconductor package includes a semiconductor chip stack disposed between first and second leads near first and second sides of the package and including a plurality of semiconductor chips, and a redistribution structure disposed on the semiconductor chip stack. At least one semiconductor chip of the semiconductor chip stack includes a plurality of first chip pads disposed near or closer to a third side of the package. The redistribution structure includes a first redistribution pad disposed near or closer to the first side and electrically connected to the first lead, a second redistribution pad disposed near or closer to the second side and electrically connected to the second lead, and a third redistribution pad disposed near or closer to the third side and electrically connected to a first one of the first chip pads and the first redistribution pad.

Abstract: A multi-channel package has at least four channels and includes a package substrate having a first surface and a second surface, semiconductor chips mounted on the first surface of the package substrate, and external connection terminals disposed on the second surface of the package substrate and electrically connected to the semiconductor chips by the at least four channels. Each channel is dedicated to one or a group of the chips. An electronic system includes a main board, at least one such multi-channel package mounted on the main board, and a controller package that is mounted on the main board, has 4n channels (wherein n?2) and controls the at least one multi-channel package.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip stacked on the substrate and a second semiconductor chip stacked on the first semiconductor chip. In the semiconductor package, the second semiconductor chip is rotated to be stacked on the first semiconductor chip. The semiconductor package is used in an electronic system.

Abstract: A semiconductor package includes a semiconductor chip stack disposed between first and second leads near first and second sides of the package and including a plurality of semiconductor chips, and a redistribution structure disposed on the semiconductor chip stack. At least one semiconductor chip of the semiconductor chip stack includes a plurality of first chip pads disposed near or closer to a third side of the package. The redistribution structure includes a first redistribution pad disposed near or closer to the first side and electrically connected to the first lead, a second redistribution pad disposed near or closer to the second side and electrically connected to the second lead, and a third redistribution pad disposed near or closer to the third side and electrically connected to a first one of the first chip pads and the first redistribution pad.

Abstract: A multi-channel package has at least four channels and includes a package substrate having a first surface and a second surface, semiconductor chips mounted on the first surface of the package substrate, and external connection terminals disposed on the second surface of the package substrate and electrically connected to the semiconductor chips by the at least four channels. Each channel is dedicated to one or a group of the chips. An electronic system includes a main board, at least one such multi-channel package mounted on the main board, and a controller package that is mounted on the main board, has 4n channels (wherein n?2) and controls the at least one multi-channel package.

Abstract: A wound healing device includes a mat of aligned nanofibers of polyaniline, o-aminobenzenesulfonic acid copolymer, polyvinyl alcohol and chitsosan oligossacaride. Method for fabricating the mat and treating wounds are also disclosed.

Abstract: A packet switched radio telecommunication system supporting hard handover adapts Always_on technology to a link between a target packet data serving node (PDSN) and a support PDSN. The support PDSN assigns a temporary IP address to a mobile terminal in its service area, and transmits handover data and the mobile terminal's temporary IP address to the target PDSN via a direct link when the mobile terminal leaves the service area. The target PDSN, upon receiving a registration request for the temporary IP address from the mobile terminal moved to its service area, temporarily registers the temporary IP address in an IP pool. The target PDSN receives down-link frame data for the mobile terminal at the temporarily registered IP address from the support PDSN via the direct link. A new temporary IP address is assigned by the target PDSN when data transmission/reception is complete to the mobile terminal.

Abstract: Provided is a combinable electrode needle base structure in which a base to which electrode needles are coupled can be used in a combined or separated state to use the electrode needles according to the size and location of a lesion. In the combinable electrode needle structure, electrode needles are connected to the front side of an electrode needle base, and receive RF waves from RF (radio frequency) generator. The electrode needle base is divided into dividable bases to which the electrode needles are respectively coupled. When a lesion to be cauterized is large or cauterization should be concentrated, the dividable bases are combined and then used, and when a lesion is small or lesions are scattered, the dividable bases may be separated and then used.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip stacked on the substrate and a second semiconductor chip stacked on the first semiconductor chip. In the semiconductor package, the second semiconductor chip is rotated to be stacked on the first semiconductor chip. The semiconductor package is used in an electronic system.

Abstract: This invention provides a semiconductor device. The semiconductor device includes a bonding pad array comprising: a signal bonding pad, a control pin bonding pad and at least one stacking bonding pad on an active surface. At least one stacking bonding pad is adjacent to the control pin bonding pad. This invention also provides a stacked structure of semiconductor devices and/or a semiconductor device package including the semiconductor device.

Abstract: A packet switched radio telecommunication system supporting hard handover adapts Always_on technology to a link between a target packet data serving node (PDSN) and a support PDSN. The support PDSN assigns a temporary IP address to a mobile terminal in its service area, and transmits handover data and the mobile terminal's temporary IP address to the target PDSN via a direct link when the mobile terminal leaves the service area. The target PDSN, upon receiving a registration request for the temporary IP address from the mobile terminal moved to its service area, temporarily registers the temporary IP address in an IP pool. The target PDSN receives down-link frame data for the mobile terminal at the temporarily registered IP address from the support PDSN via the direct link. A new temporary IP address is assigned by the target PDSN when data transmission/reception is complete to the mobile terminal.

Abstract: A packet switched radio telecommunication system supporting hard handover adapts Always_on technology to a link between a target packet data serving node (PDSN) and a support PDSN. The support PDSN assigns a temporary IP address to a mobile terminal in its service area, and transmits handover data and the mobile terminal's temporary IP address to the target PDSN via a direct link when the mobile terminal leaves the service area. The target PDSN, upon receiving a registration request for the temporary IP address from the mobile terminal moved to its service area, temporarily registers the temporary IP address in an IP pool. The target PDSN receives down-link frame data for the mobile terminal at the temporarily registered IP address from the support PDSN via the direct link. A new temporary IP address is assigned by the target PDSN when data transmission/reception is complete to the mobile terminal.

Abstract: A multi-chip package device can include a plurality of integrated circuit device chips stacked on one another inside a multi-chip package including the device. The device can include an electrically isolated multi-chip support structure that is directly connected to first and second electrically active integrated circuit structures via respective first and second adhesive layers located on opposing sides of the electrically isolated multi-chip support structure.

Abstract: This invention provides a semiconductor device. The semiconductor device includes a bonding pad array comprising: a signal bonding pad, a control pin bonding pad and at least one stacking bonding pad on an active surface. At least one stacking bonding pad is adjacent to the control pin bonding pad. This invention also provides a stacked structure of semiconductor devices and/or a semiconductor device package including the semiconductor device.

Abstract: A packet switched radio telecommunication system supporting hard handover adapts Always_on technology to a link between a target packet data serving node (PDSN) and a support PDSN. The support PDSN assigns a temporary IP address to a mobile terminal in its service area, and transmits handover data and the mobile terminal's temporary IP address to the target PDSN via a direct link when the mobile terminal leaves the service area. The target PDSN, upon receiving a registration request for the temporary IP address from the mobile terminal moved to its service area, temporarily registers the temporary IP address in an IP pool. The target PDSN receives down-link frame data for the mobile terminal at the temporarily registered IP address from the support PDSN via the direct link. A new temporary IP address is assigned by the target PDSN when data transmission/reception is complete to the mobile terminal.

Abstract: A circuit board may include an insulation plate having at least one slot. A first conductive pattern may be on the insulation plate. A plug may be on a sidewall of the slot, and may be electrically connected to the conductive pattern.

Abstract: Disclosed is a rubber liquid spray lid having an embedded pumping device comprising a rubber lid serving as a pushing member and having a plurality of first air inlet holes and a pumping force generation variable space therein, a first valve received in a first valve groove formed in the rubber lid for allowing liquid in the pumping force generation variable space to be sprayed outside, and a middle valve connected to the first valve and installed in a center portion of a lower part of the rubber lid for allowing liquid in a liquid vessel to be transferred from the liquid vessel to the pumping force generation variable space and for preventing the liquid in the pumping force generation variable space from flowing back into the liquid vessel, wherein the middle valve comprises a connecting and fixing part connected to a first end of a pipe having a second end dipped in liquid in the liquid vessel, a cover part provided to the circumferential outer surface of the connecting and fixing part, and a stepped platfo

Abstract: A bump land structure of a circuit substrate for a semiconductor package may have a combination of an SMD type bump land structure and an NSMD type bump land structure. A lower portion of a solder mask and a lower layer of a bump land may form the SMD type bump land structure. An upper portion of a solder mask and an upper layer of a bump land may form the NSMD type bump land structure.

Abstract: A semiconductor package has ball lands each configured to have a composite structure of SMD type and NSMD type. One peripheral portion of the ball land is covered with a mask layer, thus forming the SMD type, whereas the other peripheral portion is exposed through an opening area of the mask layer, thus forming the NSMD type. In one embodiment, the first peripheral portion is disposed to face a central point of a ball-mounting surface of a substrate, and the second peripheral portion is disposed to face the opposite direction to the central point. The composite structure of the ball lands provides more stable and enhanced connections between connection balls, such as solder balls, and the ball-mounting surface.

Abstract: A semiconductor package has ball lands each configured to have a composite structure of SMD type and NSMD type. One peripheral portion of the ball land is covered with a mask layer, thus forming the SMD type, whereas the other peripheral portion is exposed through an opening area of the mask layer, thus forming the NSMD type. In one embodiment, the first peripheral portion is disposed to face a central point of a ball-mounting surface of a substrate, and the second peripheral portion is disposed to face the opposite direction to the central point. The composite structure of the ball lands provides more stable and enhanced connections between connection balls, such as solder balls, and the ball-mounting surface.