Patents by Inventor Kil Yong Yun
Kil Yong Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160242284Abstract: A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layerType: ApplicationFiled: March 26, 2014Publication date: August 18, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Sam KANG, Jeong Woo PARK, Ok Tae KIM, Kil Yong YUN
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Patent number: 9078344Abstract: A printed circuit board includes: a first insulating layer; a second insulating layer of which one surface is formed to be in contact with the other surface of the first insulating layer; a first circuit pattern formed to be embedded in one surface of the first insulating layer; a second circuit pattern formed to be embedded between the first insulating layer and the second insulating layer; a third circuit pattern formed to be protruded from the other surface of the second insulating layer; and a landless fill-plating layer for filling a hole which penetrates the first insulating layer.Type: GrantFiled: May 31, 2012Date of Patent: July 7, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Don Mun, Kil Yong Yun
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Patent number: 8881381Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: GrantFiled: December 4, 2009Date of Patent: November 11, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi Sun Hwang, Myung Sam Kang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho
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Publication number: 20140202748Abstract: A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layerType: ApplicationFiled: March 26, 2014Publication date: July 24, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Sam KANG, Jeong Woo PARK, Ok Tae KIM, Kil Yong YUN
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Publication number: 20140090245Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: ApplicationFiled: December 6, 2013Publication date: April 3, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun HWANG, Myung Sam KANG, Ok Tae KIM, Seon Ha Kang, Gil Yong SHIN, Kil Yong YUN, Min Jung CHO
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Patent number: 8464423Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.Type: GrantFiled: November 14, 2011Date of Patent: June 18, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Sam Kang, Jeong Woo Park, Ok Tae Kim, Kil Yong Yun
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Publication number: 20130128472Abstract: The present invention discloses a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: forming a first circuit pattern on a metal layer formed on one surface of a base substrate; forming a second circuit pattern after laminating a first insulating layer in which the first circuit pattern is embedded; sequentially laminating a second insulating layer and a preliminary third circuit pattern on the second circuit pattern; separating the base substrate and forming a hole in the separated substrate; and forming a third circuit pattern, a landless first fill-plating layer, and a second fill-plating layer by performing fill-plating on the entire surface of the substrate in which the hole is formed, forming an insulating film layer on the other surface of the substrate, and performing an etching process on one surface and the other surface of the substrate.Type: ApplicationFiled: May 31, 2012Publication date: May 23, 2013Applicant: Samsung Electro-MechanicsInventors: Kyung Don MUN, Kil Yong Yun
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Patent number: 8141241Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern; preparing an insulating layer, and transferring the upper circuit layer to the insulating layer; and removing the metal carrier and the barrier layer.Type: GrantFiled: February 26, 2009Date of Patent: March 27, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Sam Kang, Jeong Woo Park, Ok Tae Kim, Kil Yong Yun
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Publication number: 20120061132Abstract: A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.Type: ApplicationFiled: November 14, 2011Publication date: March 15, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Sam Kang, Jeong Woo Park, Ok Tae Kim, Kil Yong Yun
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Publication number: 20120060365Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.Type: ApplicationFiled: November 14, 2011Publication date: March 15, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Sam Kang, Jeong Woo Park, Ok Tae Kim, Kil Yong Yun
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Publication number: 20110067233Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.Type: ApplicationFiled: December 29, 2009Publication date: March 24, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seon Ha Kang, Myung Sam Kang, Mi Sun Hwang, Kil Yong Yun, Min Jung Cho, Gil Yong Shin, Ok Tae Kim
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Publication number: 20110061231Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: ApplicationFiled: December 4, 2009Publication date: March 17, 2011Inventors: Mi Sun HWANG, Myung Sam KANG, Ok Tae KIM, Seon Ha KANG, Gil Yong SHIN, Kil Yong YUN, Min Jung CHO
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Publication number: 20110061912Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.Type: ApplicationFiled: December 29, 2009Publication date: March 17, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Sam Kang, Mi Sun Hwang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho
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Publication number: 20100314755Abstract: Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.Type: ApplicationFiled: July 29, 2009Publication date: December 16, 2010Inventors: Myung Sam KANG, Mi Sun Hwang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho
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Publication number: 20100193232Abstract: Disclosed herein are a printed circuit board and a process of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and circuit layers disposed at both sides of the insulating layer, each of the circuit layers including a land part and a pattern part. The land parts formed on both sides of the insulating layer are coupled to each other using electrical resistance welding. There is no need for a separate interlayer connection structure such as vias or bumps and a process of forming the interlayer connection structure, thus simplifying the printed circuit board and the process.Type: ApplicationFiled: April 15, 2009Publication date: August 5, 2010Inventors: Myung Sam Kang, Ok Tae Kim, Gil Yong Shin, Kil Yong Yun
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Publication number: 20100132985Abstract: The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.Type: ApplicationFiled: February 26, 2009Publication date: June 3, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Sam Kang, Jeong Woo Park, Ok Tae Kim, Kil Yong Yun