Abstract: An electroless gold plating solution that includes a solution- or water-soluble gold compound that provides gold ions, a complexing agent for the gold ions comprising a mixture of a sulfite and a thiosulfate in a weight ratio of greater than 1:2 to 50: 1, a reducing agent, and a benzoic acid compound having one to four hydroxyl group(s) or a solution- or water-soluble salt thereof in an amount sufficient to act as a stabilizer for the solution. Also disclosed are methods for electrolessly plating gold on a substrate or article.

Abstract: Electroless gold plating compositions that include an adhesion enhancer compound and a reduction accelerator are provided to obtain direct electroless gold plating over a gold, nickel or nickel alloy deposit. A method of electroless gold plating on a nickel-containing substrate is also disclosed.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.