Patents by Inventor Kim Chiew Ho

Kim Chiew Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat spreader for semiconductor package
    Patent number: 8049313
    Abstract: A heat spreader (50) for a semiconductor package (100) includes a heat dissipating portion (52) having a recessed periphery (54). A thermosetting resin (58) is disposed in the recessed periphery (54). The heat spreader (50) may include a heat absorbing portion (56) coupled to the heat dissipating portion (52).
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: November 1, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Chee Seng Foong, Kim Chiew Ho
  • HEAT SPREADER FOR SEMICONDUCTOR PACKAGE
    Publication number: 20080067645
    Abstract: A heat spreader (50) for a semiconductor package (100) includes a heat dissipating portion (52) having a recessed periphery (54). A thermosetting resin (58) is disposed in the recessed periphery (54). The heat spreader (50) may include a heat absorbing portion (56) coupled to the heat dissipating portion (52).
    Type: Application
    Filed: September 20, 2006
    Publication date: March 20, 2008
    Inventors: Chee Seng Foong, Kim Chiew Ho